Laser-based joining for the packaging of miniature optoelectronic devices

Duncan P. Hand; Norbert Lorenz; Martin D. Smith; Suzanne Millar; Marc Desmulliez

doi:10.1117/12.841280

23 February 2010 Laser-based joining for the packaging of miniature optoelectronic devices

Duncan P. Hand, Norbert Lorenz, Martin D. Smith, Suzanne Millar, Marc Desmulliez

Proceedings Volume 7585, Laser-based Micro- and Nanopackaging and Assembly IV; 758504 (2010) https://doi.org/10.1117/12.841280
Event: SPIE LASE, 2010, San Francisco, California, United States

Abstract

In recent years various techniques have been developed for the manufacture of microsystems and other miniature optoelectronic devices. One aspect where there remains significant room for improvement is the packaging process. Standard packaging techniques involve heating whole devices to high temperatures, in some cases combined with strong electric fields, preventing the use of temperature-sensitive materials within the package and generating problems in manufacturing processes where a number of thermal process steps are carried out sequentially, when a later heating step can cause parts joined earlier to disassemble. Here we describe the successful application of laser-based joining for the packaging of such devices.

Citation Download Citation

Duncan P. Hand, Norbert Lorenz, Martin D. Smith, Suzanne Millar, and Marc Desmulliez "Laser-based joining for the packaging of miniature optoelectronic devices", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758504 (23 February 2010); https://doi.org/10.1117/12.841280

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