Paper
19 November 2001 Damping caused by the gas flow in the holes of perforated structures
Heng Yang, Minhang Bao, Lukasz Pakula, Patrick J. French
Author Affiliations +
Proceedings Volume 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II; (2001) https://doi.org/10.1117/12.448862
Event: International Symposium on Microelectronics and MEMS, 2001, Adelaide, Australia
Abstract
This paper investigates the effect of gas flow in holes on the squeeze film damping of perforated structures. An infinite perforated plate with circular holes is analyzed with an analytical model. The results show that there is a minimum damping ratio for a certain size ratio. The corresponding hole size can be defined as a critical size. When the hole size is smaller than the critical size, the hole effect dominates. The damping ratio increases drastically with hole size decreasing when the size ratio keeps constant. Some finite two-dimensional structures are analyzed with an equivalent circuit model. Similar results are obtained. The finite two-dimensional structures and some quasi three-dimensional structures are also simulated with ANSYS/FLOTRAN. The results are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heng Yang, Minhang Bao, Lukasz Pakula, and Patrick J. French "Damping caused by the gas flow in the holes of perforated structures", Proc. SPIE 4593, Design, Characterization, and Packaging for MEMS and Microelectronics II, (19 November 2001); https://doi.org/10.1117/12.448862
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Cited by 2 scholarly publications.
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KEYWORDS
Circuit switching

3D modeling

Analytical research

Statistical analysis

Electrodes

Finite element methods

Microelectromechanical systems

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