Paper
28 August 2003 Pattern inspection of EUV mask using an EUV microscope
Takeo Watanabe, Tsuneyuki Haga, Tsutomu Shoki, Kazuhiro Hamamoto, Shintaro Takada, Naoki Kazui, Satoshi Kakunai, Harushige Tsubakino, Hiroo Kinoshita
Author Affiliations +
Abstract
It is proposed that at-wavelength EUV mask inspection system based on EUV microscope, which is the best way to observe the mask directly. Using this system, preliminary experiments to examine the pattern inspection of EUVL mask is carried out. EUV microscope has a capability to resolve 50 nm lithographic node finished EUVL mask. We confirmed that at-wavelength microscope rather than SEM is both powerful and useful for evaluating the mask fabrication process for EUVL. Furthermore, it is find out that the contrast of the mask images observed by EUVM influenced by the absorber material. As the result, important information of the finished EUVL mask can be obtained utilizing EUVM, which is very important tool for the finished EUVL mask inspection.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takeo Watanabe, Tsuneyuki Haga, Tsutomu Shoki, Kazuhiro Hamamoto, Shintaro Takada, Naoki Kazui, Satoshi Kakunai, Harushige Tsubakino, and Hiroo Kinoshita "Pattern inspection of EUV mask using an EUV microscope", Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); https://doi.org/10.1117/12.504240
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Cited by 4 scholarly publications.
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KEYWORDS
Photomasks

Extreme ultraviolet

Extreme ultraviolet lithography

Microscopes

Inspection

Scanning electron microscopy

Multilayers

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