Paper
17 December 2003 Second-level imaging of advanced alternating phase-shift masks using e-beam lithography
Bernd Leibold, Joerg Butschke, Lutz Bettin, Dirk Beyer, Mathias Irmscher, Corinna Koepernik, Rainer Plontke, Armelle Vix, Peter Voehringer
Author Affiliations +
Abstract
When e-beam lithography is applied for second level imaging of Alternating Phase Shift Masks charging effects on the cleared chrome absorber induces placement, overlay and pattern distortion of the second layer. The water soluble conductive to coat Showa Denko ESPACER 300Z has been evaluated in combination with the chemically amplified resist FEP171 for a charging eliminating patterning solution. Application of ESPACER on top of FEP171 kept the resist performance unchanged. Sensitivity, profile, resolution, CD-uniformity and post exposure delay of FEP171 have been investigated and no influence of ESPACER was detected. The bilayer system ESPACER and FEP171 was used for the second patterning of an altPSM test design and the technology performance was characterized. No difference has been figured out between placement of the second level and placement on a non-structured chrome layer. The achieved overlay accuracy proves the ESPACER/FEP171 combination as a promising approach for future altPSM manufacturing.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernd Leibold, Joerg Butschke, Lutz Bettin, Dirk Beyer, Mathias Irmscher, Corinna Koepernik, Rainer Plontke, Armelle Vix, and Peter Voehringer "Second-level imaging of advanced alternating phase-shift masks using e-beam lithography", Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); https://doi.org/10.1117/12.518037
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Cited by 3 scholarly publications.
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KEYWORDS
Quartz

Electron beam lithography

Distortion

Photomasks

Thin film coatings

Overlay metrology

Etching

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