Paper
28 May 2004 Study of OPC for AAPSM reticles using various mask fabrication techniques
Gregory P. Hughes, Denny Kamaruddin, Kent H. Nakagawa, Susan MacDonald, Bill Wilkinson, Craig West, Keuntaek Park
Author Affiliations +
Abstract
AAPSM masks require OPC correction through pitch in order to print a linear dark line response vs the design CDs. The masks also require correction for the clear intensity imbalance caused by the phased etched Qz wall edge. The clear intensity can be balanced by two approaches;(or a combination of the two) data biasing or wet undercut etching of the Qz etched opening. IC manufacturers would like to use one OPC model that will work for any mask fabrication approach. This paper shows that there is no OPC difference observed in either the aerial image or the printed image of several OPC learning patterns. The study includes CD through pitch for dense (1:1) L/S Patterns and Isolated Line CD vs line-space ratio. The images were analyzed for the dark line linearity, the clear CD balance though pitch, and the clear CD balance with focus (phase error effects -PES).
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregory P. Hughes, Denny Kamaruddin, Kent H. Nakagawa, Susan MacDonald, Bill Wilkinson, Craig West, and Keuntaek Park "Study of OPC for AAPSM reticles using various mask fabrication techniques", Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); https://doi.org/10.1117/12.536138
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KEYWORDS
Photomasks

Semiconducting wafers

Data modeling

Optical proximity correction

Etching

Mask making

Photoemission spectroscopy

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