The development of affordable front-end hardware for mm-wave imaging using multilayer softboard technology

Paul D. Munday; Jeff Powell; Dave Bannister; Paul J. Rice

doi:10.1117/12.723783

1 May 2007 The development of affordable front-end hardware for mm-wave imaging using multilayer softboard technology

Paul D. Munday, Jeff Powell, Dave Bannister, Paul J. Rice

Proceedings Volume 6548, Passive Millimeter-Wave Imaging Technology X; 65480G (2007) https://doi.org/10.1117/12.723783
Event: Defense and Security Symposium, 2007, Orlando, Florida, United States

Abstract

Millimetre-wave (mm-wave) imaging systems for a number of applications rely on a multitude of receiver modules mounted at the focal plane of focusing optics. Analysis shows that the receiver front-end forms a significant proportion of the overall cost of an imaging system restricting market take-up of commercial systems for security screening and all weather vision. The cost of imager front-ends can be significantly reduced by the use of low-cost multi-layer softboard technology used for RF printed circuit boards (PCBs) and new monolithic microwave integrated circuit (MMIC) chipsets with fewer MMIC devices. Modelled performance of W-band mm-wave imaging receiver using these techniques shows effective bandwidths of 38GHz and noise equivalent temperature difference (NETD) of 0.3K when using a 0.2ms integration time. This performance is achieved with a potential cost saving of about 60%.

Citation Download Citation

Paul D. Munday, Jeff Powell, Dave Bannister, and Paul J. Rice "The development of affordable front-end hardware for mm-wave imaging using multilayer softboard technology", Proc. SPIE 6548, Passive Millimeter-Wave Imaging Technology X, 65480G (1 May 2007); https://doi.org/10.1117/12.723783

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