Paper
19 May 2015 Video rate passive millimeter-wave imager utilizing optical upconversion with improved size, weight, and power
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Abstract
In this presentation we will discuss the performance and limitations of our 220 channel video rate passive millimeter wave imaging system based on a distributed aperture with optical upconversion architecture. We will cover our efforts to reduce the cost, size, weight, and power (CSWaP) requirements of our next generation imager. To this end, we have developed custom integrated circuit silicon-germanium (SiGe) low noise amplifiers that have been designed to efficiently couple with our high performance lithium niobate upconversion modules. We have also developed millimeter wave packaging and components in multilayer liquid crystal polymer (LCP) substrates which greatly improve the manufacturability of the upconversion modules. These structures include antennas, substrate integrated waveguides, filters, and substrates for InP and SiGe mmW amplifiers.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard D. Martin, Shouyuan Shi, Yifei Zhang, Andrew Wright, Peng Yao, Kevin P. Shreve, Christopher A. Schuetz, Thomas E. Dillon, Daniel G. Mackrides, Charles E. Harrity, and Dennis W. Prather "Video rate passive millimeter-wave imager utilizing optical upconversion with improved size, weight, and power", Proc. SPIE 9462, Passive and Active Millimeter-Wave Imaging XVIII, 946209 (19 May 2015); https://doi.org/10.1117/12.2177133
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CITATIONS
Cited by 6 scholarly publications.
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KEYWORDS
Imaging systems

Upconversion

Extremely high frequency

Optical amplifiers

Antennas

Waveguides

Video

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