Paper
26 May 2010 Efficiently writing circular contacts on production reticle
Aki Fujimura, Christophe Pierrat, Taiichi Kiuchi, Tadashi Komagata, Yasutoshi Nakagawa
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Abstract
As we prepare for 32nm-hp with 193nm immersion, complex and sometimes curvilinear shapes are going to be required on masks. Contacts and vias will be circular or oval in shape on the wafer, but are still drawn as over-sized squares or rectangles on masks and in CAD systems. Yet, for packing density of designs, particularly for DRAMs and SRAMs, in order to optimize for diagonal distances, a circular via shape on the mask is desirable. In addition, a circle has by definition the minimum perimeter for a given area, improving manufacturing tolerance. This paper demonstrates new techniques for writing circles of arbitrary diameters on masks efficiently and accurately using a production e-beam mask writer. Resist-exposed SEM images are shown, demonstrating the practicality of writing circles as mask shapes for production reticles.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aki Fujimura, Christophe Pierrat, Taiichi Kiuchi, Tadashi Komagata, and Yasutoshi Nakagawa "Efficiently writing circular contacts on production reticle", Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77481P (26 May 2010); https://doi.org/10.1117/12.866412
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CITATIONS
Cited by 10 scholarly publications and 3 patents.
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KEYWORDS
Photomasks

Computer aided design

Semiconducting wafers

Manufacturing

Reticles

Vestigial sideband modulation

CAD systems

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