To meet these challenges a new height map reconstruction technique was introduced, using the CDSEM side detectors signal. Measuring pixel by pixel position in X, Y and Z (height) dimensions, we can obtain the buckling vector gradient along the wire in three dimensions. In this paper we present: (1) A description of the height map reconstruction technique used. (2) Three dimensional characterization of SiNW: (a) SiNW buckling measurements (b) Characterization of buckling as a function of the SiNW length and width. |
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CITATIONS
Cited by 3 scholarly publications.
Sensors
Signal detection
Silicon
3D metrology
Scanning electron microscopy
Nanowires
Transmission electron microscopy