28 April 2023 Interaction between aberrations and mask 3D effects for low-n and Ta-based absorbers in extreme ultraviolet lithography
Author Affiliations +
Abstract

Low-n masks have gained strong interest due to their potential to simultaneously improve dose and imaging contrast for dense clips. We have previously presented that for the imaging of isolated features mask bias, assist features are crucial to minimize the focus range through pitch. In this paper, we elaborate on aberration sensitivity for different mask-absorber types. We observe that even aberration sensitivities can change significantly by changing the mask-absorber type for the same use case. We show that even aberration sensitivity and best-focus shifts are coupled and that they can also be solved together by applying mask and target bias and/or assist features. Finally, we show how assist-feature position optimization can reduce the impact of odd aberrations on two-bar features.

© 2023 Society of Photo-Optical Instrumentation Engineers (SPIE)
M.-Claire van Lare, Jo Finders, and Tasja van Rhee "Interaction between aberrations and mask 3D effects for low-n and Ta-based absorbers in extreme ultraviolet lithography," Journal of Micro/Nanopatterning, Materials, and Metrology 22(2), 024402 (28 April 2023). https://doi.org/10.1117/1.JMM.22.2.024402
Received: 17 January 2023; Accepted: 31 March 2023; Published: 28 April 2023
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KEYWORDS
3D mask effects

SRAF

Diffraction

Extreme ultraviolet lithography

Semiconducting wafers

3D image processing

Light sources and illumination

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