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Cor Kochanowski
at Neways Micro Electronics B.V.
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 31 August 2022 Poster + Paper
The detector/readout-electronics assembly of the eXTP wide field monitor
F. Zwart, R. Tacken, J. J. in't Zand, R. de la Rie, M. Limpens, C. Kochanowski, G. Aitink-Kroes, C. van Baren, J. Bayer, D. Baudin, F. Ceraudo, Y. Evangelista, M. Feroci, M. Frericks, J.-L. Gálvez, O. Gevin, M. Hernanz, A. Hormaetxe, P. Laubert, A. Meuris, J. Nab, J. Neelis, C. Tenzer, C. Vogel, G. Zampa
Proceedings Volume 12181, 1218167 (2022) https://doi.org/10.1117/12.2629406
KEYWORDS: Sensors, Electronics, Cameras, Adhesives, Silicon, Hybrid circuits, Spatial resolution, Manufacturing, Electrons, Temperature metrology
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