A series of AlAsSb p+-i-n+ and n+-i-p+ diodes with varying i-region thickness from 0.08μm to 1.55μm have been used to determine the temperature dependent impact ionization coefficients by performing avalanche multiplication measurements from 210K to 335K. The increase in electron and hole ionization coefficients as the temperature decreases is much smaller when compared to InAlAs and InP. This leads to a much smaller avalanche breakdown variation of 13mV/K in a 1.55μm p+- i-n+ diode. For a 10Gb/s InGaAs/AlAsSb separate absorption and multiplication avalanche photodiode (SAM-APD), the variation in breakdown voltage is predicted to be only 15.58 mV/K.
II-VI compounds are promising materials for the fabrication of room-temperature terahertz devices due to their beneficial properties like as type-I conduction band alignment, high breakdown field strength (~331 kV/cm for ZnSe vs. ~80 kV/cm for GaAs), and higher values of the conduction band offset (1.5 eV for BeSe/ZnSe vs. 0.7 eV for AlAs/GaAs). In this paper we report on numerical study of the resonant tunneling transport in ZnBeSe/ZnSe/ZnBeSe symmetric and asymmetric resonant tunneling diodes (RTDs). The negative differential resistance feature is observed in the current-voltage characteristics of the ZnSe-based RTDs. It is found that the maximum of peak-to-valley ratio (PVR) of the current density is equal to 6.025 and 7.144 at 150 K, and to 1.120 and 1.105 at 300 K for the symmetric and asymmetric RTDs, respectively. The effect of barrier heights on the frequency and output power performance of RTD devices are studied and discussed.
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