Dr. Hans Reinhard Schubach Profile

Dr. Hans Reinhard Schubach

at Dantec Dynamics GmbH

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Proceedings Article | 27 May 2011 Paper

Recent developments and applications for optical full field strain measurement using ESPI and DIC

Thorsten Siebert, Hans-Reinhard Schubach, Karsten Splitthof

Proceedings Volume 7997, 79972B (2011) https://doi.org/10.1117/12.891864

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Optical measurement techniques for full-field analysis of deformation, strain and vibration are commonly used in various fields of mechanical engineering. The focus of this presentation is on the recent developments and applications of the Electronic Speckle Pattern Interferometry (ESPI) and Digital Image Correlation (DIC) technique. The full-field function allows an easy understanding of processes and designs under various conditions and their optimizations. We present a brief overview about recent applications of ESPI for the determination of static strain in composite and inhomogeneous materials and the use of the technique for optimization of the design of components in automotive applications. DIC techniques have proven to be a flexible and useful tool for deformation analysis. Modern algorithm and computer allows the calculation of the full-field three-dimensional displacement and strain in real-time. This information can be converted to an electronic analog signal and be used for the real-time monitoring of the test. Using High Speed cameras the DIC technique can be applied to vibration problems and a high resolution in the temporal domain can be achieved. Different types of loading, like harmonic, shock or noise excitation, are applicable.

Proceedings Article | 28 April 2006 Paper

Measurement of thermal expansion of MEMS and electronic components

Hans Reinhard Schubach

Proceedings Volume 6188, 61880Q (2006) https://doi.org/10.1117/12.662827

KEYWORDS: Electronic components, Temperature metrology, Microelectromechanical systems, Sensors, 3D metrology, Finite element methods, Speckle interferometry, Aerospace engineering, Reliability, Spatial resolution

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MEMS as well as electronic components are used in the automotive, communication, aerospace and other industries. Miniaturization, higher package density and accelerated development processes have a great impact on the reliability of components. Rapid changes of ambient temperature or internal production of heat may occur during operation. This may create high thermal stresses due to the mismatch of the thermal expansion coefficients of the different materials in electronic components. On the other side simulations (FEA,...) are used in the electronic industry, but the material parameters (coefficient of thermal expansion, young's modulus,...) have to been known. A validation of results is necessary. In some cases simulations are not possible, than the measurement precise deformation is necessary. The 3D electronic speckle interferometry is a very powerful tool to investigate the thermal expansion of MEMS and electronic components. Due to the full field measuring technique combined with a high resolution the determination of critical areas and hot spots in electronic components is very easy. The capability of this measuring technique will be shown on examples like the NDT testing of flip chips, thermal deformation of BGA and a yaw sensor.

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