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Hiroshi Matsui
Manager at Dainippon Screen Manufacturing Co Ltd
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Publications (1)
Proceedings Article | 3 April 2010 Paper
A novel lithography process for 3D (three-dimensional) interconnect using an optical direct-writing exposure system
T. Azuma, M. Sekiguchi, M. Matsuo, A. Kawasaki, K. Hagiwara, H. Matsui, N. Kawamura, K. Kishimoto, A. Nakamura, Y. Washio
Proceedings Volume 7637, 76371O (2010) https://doi.org/10.1117/12.846013
KEYWORDS: Optical alignment, Semiconducting wafers, Lithography, Wafer-level optics, Reflectivity, Infrared imaging, Semiconductors, Microfabrication, Chemically amplified resists, Photoresist processing
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