As the device feature size continues to shrink, the restriction of particles size is more critical. More effective tools are needed to identify the shaped and the contents of particles, then take corrective actions. In this paper, the source and formation of the flat type metal residue that cause metal line bridge were identified by KLA scan defect inspector and optical microscope review. The duplication of this flat type metal residue also has been achieved. And the effective monitor tool is provided in the paper to prevent the particle forming.
The photoresist stripping process in passivation stage could induce the bonding pad surface corrosion (Figure-i). And
the bonding pad surface corrosion rates will be accelerated if the chlorine concentration levels reach 5 to i 0 ppb in the
cleanroom environment. The facility hookup of the exhaust pipelines and the cross contamination between the different
airflow system has been identified to be critical regarding the chlorine concentration levels. In order to improve the pad
surface susceptibility toward the chlorine molecules induced pad surface corrosion, the CF4 treatment is proposed with
excellent passivation and replacement effects.
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