A new planarization technique with an instantaneous tiny-grinding wheel cluster that is based on the magnetorheological
(MR) effect is presented in this paper. The B-H curve of the MR polishing fluid is calculated, and the results show that
the B-H curve is nearly linear and its relative magnetic permeability is about 2.63. Based on the above results, three
designs of the polishing disc with the tiny-grinding wheel cluster are analyzed by using the electromagnetic field finite
element simulation software. The simulation results show that the design where the magnetic poles are fixed alternately
and contrarily to form a closed magnetic circuit has the optimum effect.
Based on electro-magneto-rheological (EMR) effect, this paper presents a novel micro machining method to form an
instantaneous tiny-grinding wheel to polish the surface of optical glass, ceramic and other rigid-fragile materials under
both electric and magnetic field. Experiments were conducted to reveal the synergistic effect of electrorheological and
magnethorheological effect, and the effects of process parameters, such as intensity of electric field, intensity of
magnetic field, working time, machining gap between the workpiece and the needle-like tool, on material removal rate of
glass surface. Experimental results confirm the effectiveness of the micro machining technique with EMR effect-based
tiny-grinding wheel and the machining efficiency under the combination of electric and magnetic field is much greater
than the one under applied external electric or magnetic field. The material removal rate of workpiece is directly
proportional to the intensity of external electric field and will maintain stable when the voltage of external electric field
reaches 2000v, while the material removal rate is directly proportional to the intensity of external magnetic field. The
material removal rate markedly descends with the increase of the machining gap. In addition, the working time is directly
proportional to the amount of material removal of workpiece, but inversely proportional to material removal rate.
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