Mr. Jun Cheng Profile

Jun Cheng

at Chinese Univ of Hong Kong

SPIE Involvement:

Author

Publications (6)

SPIE Journal Paper | 1 June 2008

Publisher's Note: Projection optics design for tilted projection of fringe patterns

Jun Cheng, Edmund Lam, Kenneth S. Fung, Fan Wang, Yuan Shu, Ronald Chung, Zheng Tan

OE, Vol. 47, Issue 06, 069802, (June 2008) https://doi.org/10.1117/12.10.1117/1.2951968

SPIE Journal Paper | 1 May 2008

Projection optics design for tilted projection of fringe patterns

Yuan Shu, Ronald Chung, Zheng Tan, Jun Cheng, Edmund Lam, Kenneth Fung, Fan Wang

OE, Vol. 47, Issue 05, 053002, (May 2008) https://doi.org/10.1117/12.10.1117/1.2931457

KEYWORDS: Optical design, Inspection, Projection systems, Modulation transfer functions, Binary data, Lens design, Tolerancing, Optical engineering, Distortion, Semiconducting wafers

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Proceedings Article | 9 February 2006 Paper

Surface orientation recovery of specular micro-surface via binary pattern projection

Zhan Song, Ronald Chung, Jun Cheng, Edmund Lam

Proceedings Volume 6070, 60700S (2006) https://doi.org/10.1117/12.650026

KEYWORDS: Inspection, Binary data, Distortion, Sensors, Error analysis, 3D modeling, Calibration, Semiconducting wafers, Corner detection, Structured light

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Proceedings Article | 9 February 2006 Paper

Boundary detection of projected fringes on surface with inhomogeneous reflectance function

Jun Cheng, Ronald Chung, Edmund Lam, Kenneth S. M. Fung, Fan Wang, W. Leung

Proceedings Volume 6070, 607003 (2006) https://doi.org/10.1117/12.648604

KEYWORDS: Binary data, Reflectivity, Inspection, Calibration, Semiconducting wafers, Sensors, Edge detection, 3D image processing, Image compression, Fringe analysis

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Proceedings Article | 26 January 2006 Paper

A novel design of grating projecting system for 3D reconstruction of wafer bumps

Yuan Shu, Ronald Chung, Zheng Tan, Jun Cheng, Edmund Lam, Kenneth Fung, Fan Wang

Proceedings Volume 6056, 605601 (2006) https://doi.org/10.1117/12.650023

KEYWORDS: Modulation transfer functions, Lens design, Binary data, Optical design, Inspection, Semiconducting wafers, Tolerancing, 3D modeling, Projection systems, Optics manufacturing

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Proceedings Article | 24 February 2005 Paper

Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

Jun Cheng, Ronald Chung, Edmund Lam, Kenneth Fung, Fan Wang, Wing Leung

Proceedings Volume 5679, (2005) https://doi.org/10.1117/12.586628

KEYWORDS: Binary data, Inspection, Semiconducting wafers, Cameras, 3D modeling, Light sources, Ronchi rulings, Sensors, Imaging systems, 3D image reconstruction

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Showing 5 of 6 publications

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