KEYWORDS: Digital holography, 3D image processing, 3D metrology, Thin films, Holography, Microelectromechanical systems, Microscopes, Holograms, Atomic force microscopy, 3D acquisition
Digital Holography is a new technology that promises many applications in diverse areas. Using numerical
reconstruction of digitally recorded hologram, the Reflection Digital Holographic Microscope (DHM) provides the
intensity, phase images which give the 3D depth profile of micro-devices. These essential data provided by digital
holography are very useful for new MEMS design and fabrication as well as thin film growth. Having advantages over
other existing measurement methods, it can possibly serve as an easier alternative in future. In this study, we further
investigate the accuracy and specifications of thickness measurement, topography and roughness analysis using the
DHM. By comparing the DHM results with alpha-stepper (a form of stylus probing) and Atomic Force Microscope
(AFM), we find that the accuracy of the DHM for thickness measurement and roughness analysis is about 10%. The
thickness and roughness range is also found to be 50nm to 500nm. Our experimental study hence demonstrates that
digital holography has the potential to be developed into a suitable tool for thickness measurement and roughness
analysis due to it being non-invasive and being able to provide quick time and relatively accurate measurements.
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