Mr. Paul A. White Profile

Paul A. White

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Proceedings Article | 20 October 1993 Paper

High-performance, miniaturized processor trends

Paul White, Lynda Graceffo, John Hodapp, Dolores Shaffer, Jon Hiller, Edward Monachino

Proceedings Volume 1957, (1993) https://doi.org/10.1117/12.161435

KEYWORDS: Packaging, Signal processing, Silicon, Semiconducting wafers, Data processing, Software development, Algorithm development, Digital signal processing, Sensors, Telecommunications

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It is widely recognized that processors developed for many different uses in the near future must be faster, more versatile, easier to use, less costly, and -- in many cases -- smaller than those currently available. The required increase in functionality is associated with many factors, including: (1) the increasing complexity of the algorithms being developed for various applications (e.g., aided/automatic target recognition -- ATR); (2) the development of larger sensor arrays for both focal plane arrays (FPAs) and synthetic aperture radars (SARs); (3) real-time performance needs for processing-intensive systems deployed on a wide variety of platforms; (4) more-stringent requirements on sensor resolution; (5) the need for effective sensor fusion to handle data available from multiple sources; (6) increased intra- and inter- platform communications; and (7) hardware/software development and implementation costs. This paper discusses ongoing and required work related to component development and electronics packaging critical to meeting future processing requirements within reasonable size, weight, and power constraints.

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