A three dimensional electro-mechanical continuum field model is developed to analyze the
constrained boundary effects on the transduction performance of thin Piezoelectric
films. The model proposed in this paper for Piezoelectric thin film is
based on 3D continuum mechanics under plane-stress condition. The
plane-stress condition is justifiable for the fact that the
thickness of the piezoelectric film is of the order of microns(in 'z'
direction); and hence, very small in comparison to the other two
dimensions(in 'x' and 'y' directions) of the film. The film, and
its proposed model, are intended to be used for Structural Health
Monitoring of any structural component, such as, wing of an
aircraft. The thin film is surface-mounted on this structural
component, and this component will be termed as Host structure,
henceforth. When the host structure is strained under the action
of loads, the displacement vector field that is generated acts as
an input to the thin film in this model. The performance of the
thin film in terms of its voltage response, capacitance, and
effect of residual stresses on capacitance and output voltage are
studied here. The results show significant variation of the same
as compared to conventional design and analysis based on electro-statics.
The voltage distribution and its variation over the film when a
crack is initiated in the host structure under mode-I and mode-II
loadings are also presented. It has been observed that in microelectronic devices, various process-induced
stresses such as intrinsic stress, epitaxial stress, thermal stress etc., play crucial role in the device
performance. The model presented here is capable of handling such
stresses while designing the sensor itself.
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