Mr. Shishir K. Singh Profile

Shishir K. Singh

at Szewalski Institute of Fluid-Flow Machinery, Polish Academy of Sciences

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Publications (6)

Proceedings Article | 9 May 2024 Presentation + Paper

Damage detection in 3D-printed plate using the electromechanical impedance method with surface bonded and embedded sensors

Shishir Kumar Singh, Artur Andrearczyk, Paweł Malinowski

Proceedings Volume 12951, 1295111 (2024) https://doi.org/10.1117/12.3011812

KEYWORDS: Sensors, Damage detection, Resistance, Printing, 3D printing, Transducers, Additive manufacturing, Actuators

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Proceedings Article | 25 April 2023 Presentation + Paper

A machine-learning-based health diagnosis of polymer 3D-printed plates using the electromechanical impedance method

Shishir Kumar Singh, Mohammad Ali Fakih, Artur Andrearczyk, Abdalraheem Ijjeh, Paweł Malinowski

Proceedings Volume 12488, 124880X (2023) https://doi.org/10.1117/12.2658377

KEYWORDS: Principal component analysis, Cross validation, 3D printing, Polymers, Artificial neural networks, Transducers, Data fusion, Structural health monitoring, Deep learning, Additive manufacturing

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Proceedings Article | 19 April 2022 Presentation + Paper

Sensor network based damage detection of structures using weight function in electromechanical impedance method

Shishir Singh, Rohan Soman, Pawel Malinowski

Proceedings Volume 12048, 1204813 (2022) https://doi.org/10.1117/12.2612785

KEYWORDS: Composites, Electromagnetic coupling, Sensor networks, Damage detection, Sensors, Data fusion

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Proceedings Article | 19 April 2022 Presentation + Paper

Lamb-wave propagation characteristics and damage imaging in additively manufactured plates

Mohammad Ali Fakih, Shishir Kumar Singh, Pawel Malinowski

Proceedings Volume 12048, 120480O (2022) https://doi.org/10.1117/12.2612837

KEYWORDS: Additive manufacturing, Wave propagation, Polymers, Fused deposition modeling, Structural health monitoring, Damage detection, 3D printing, Nondestructive evaluation, Ultrasonics

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Proceedings Article | 22 March 2021 Presentation + Paper

Damage study of structures using Hotteling's T2 curve in electromechanical impedance method

Shishir Singh, Paweł Malinowski

Proceedings Volume 11592, 115920Y (2021) https://doi.org/10.1117/12.2583942

KEYWORDS: Sensors, Sensor networks, Principal component analysis, Electromagnetic coupling, Data fusion, Structural health monitoring, Damage detection, Sensor technology, Semiconducting wafers, Resistance

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Proceedings Article | 1 April 2019 Paper

An innovative decentralised data fusion using electromechanical impedance techniques

Shishir Singh, Tomasz Wandowski, Paweł Malinowski

Proceedings Volume 10972, 109720B (2019) https://doi.org/10.1117/12.2513275

KEYWORDS: Sensors, Data fusion, Sensor networks, Composites, Transducers, Principal component analysis, Ferroelectric materials, Visualization

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Showing 5 of 6 publications

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