Optical interconnect is essential for massive data communication in rapidly developed data center and high-performance computing infrastructures. Large bandwidth, high energy efficiency and low latency are intrinsic advantages in optics. But they are also present R&D challenges under new requirements such as low total solution cost and reliable operation in harsh computing environment. Recently we have developed hybrid microring lasers on silicon to enable high integration density, compact chip size, and potentially volume and cost-effective production in a CMOS foundry. Novel structures such as thermal shunts and hybrid metal-oxide-semiconductor (MOS) capacitors were integrated into the laser cavity to allow over 100 oC cw operation and "zero-power" laser wavelength and power control. Special CMOS driver with equalization functionality for direct microring laser modulation with good signal integrality was also designed and fabricated in a 65 nm foundry process. For the first time, we integrated all these designs and chips together to demonstrate a 5-channel hybrid transmitter with 0.5 nm channel spacing and overall 70 Gb/s direct modulation rate. A novel direct photon lifetime modulation with much larger bandwidth than conventional injection current modulation by modulating bias on the MOS capacitor is demonstrated for the first time as well. Finally we review our on-going progress on migrating the similar design from a standard quantum well laser active region to a superior quantum-dot one for further improved temperature and dynamic performance.
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