Ms. Xueli Li Profile

Xueli Li

at 11th Research Institute of CETC

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Proceedings Article | 5 November 2020 Paper

Analysis on reliability of cooling head in large-array infrared focal plane detector

Xueli Li, Lei Zhang, Ti Ning, Chenggang Wang

Proceedings Volume 11563, 115630D (2020) https://doi.org/10.1117/12.2579724

KEYWORDS: Reliability, Sensors, Infrared detectors, Adhesives, Infrared sensors, Metals, Packaging

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With the development of infrared technology, large-array infrared focal plane detector is getting more and more popular. In order to solve the problem of reduced reliability when the cooling head is packaged with large-array infrared detector, a new design with reinforcement structures on cold platform and cold shield is introduced in this paper. The finite element simulation is used to analyze the optimized structure, and the results show that this design can fully meet the mechanical requirements of the project. By using the reinforcement structures, a Dewar was designed and processed to package a 2.7K×2.7K-15μm large-array infrared detector. After all the packaging process, the total mass of the Dewar is only 800g, and the cooling head is more than 90g. Under the circumstances of a heavy cooling head, the Dewar successfully passed the environmental adaptability assessment, and there is no problem with all the indexes of the infrared focal plane detector, which verified the reliability of the reinforcement structure.

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