Mr. Xiaodong Zhang Profile

Xiaodong Zhang

at National Univ of Defense Technology

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Proceedings Article | 6 June 2021 Paper

Experimental study on removal of antireflection sol-gel SiO2 coating of fused silica assisted by ion beam etching

Yaoyu Zhong, Ci Song, Yifan Dai, Feng Shi, Xiaodong Zhang

Proceedings Volume 11849, 1184914 (2021) https://doi.org/10.1117/12.2599083

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The nondestructive and economical removal of sol-gel SiO₂ coating is significant for the recovery and reuse of fused silica optical elements. Compared with conventional wet cleaning process, ion beam etching as a dry cleaning process has atomic-scale removal capacity which is highly stable, non-contact and environment-friendly. In this research, a series of ion beam etching experiments is conducted to investigate the removal efficiency of antireflection sol-gel SiO₂ coating and substrate material. The etched surface roughness and optical performance are also studied. The best removal parameters during ion beam etching are determined based on the maximum removal efficiency ratio between antireflection sol-gel SiO₂ coating and substrate material. Moreover, the surface roughness and shape of fused silica are both improved during ion beam etching process. The optical transmission of etched surface is reduced to the substrate level and the surface chemical structure remains the same. The results can be a reference for using ion beam etching process technology to clean antireflection sol-gel SiO₂ coating of fused silica optics in inertial confinement fusion facility.

Proceedings Article | 5 November 2020 Paper

Study on the optimization of parameters in ultrasonic vibration turning of single crystal silicon

Xiaodong Zhang, Feng Shi, Guipeng Tie, Yongxiang Shen

Proceedings Volume 11568, 115681O (2020) https://doi.org/10.1117/12.2580188

KEYWORDS: Silicon, Ultrasonics, Crystals, Surface finishing

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The ultrasonic vibration cutting (UVC) method is an efficient cutting technique for the hard and brittle materials. The influence of ultrasonic vibration parameters on the critical cutting thickness (CCT) of single crystal silicon was investigated by spirally grooving experiment, and a series of experimental trials were carried out by using different cutting duty ratios (CDR). The results show that: the ultrasonic vibration efficiency is closely related to CDR, and increases with the decrease of CDR; when the ultrasonic vibration frequency and velocity were fixed, the CCT decreases as the vibration amplitude increases; the smaller the CDR is, the higher the surface finish of single crystal silicon machined by UVC will achieve. In the cutting tests, the experiment in which the value of CDR is 0.13, realized the ductile mode cutting for the Φ100mm specimen in the whole area.

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