Ultrafast laser microwelding of glass and other materials with a picosecond laser

Terence Hollister; Jim Bovatsek

doi:10.1117/12.2578777

5 March 2021 Ultrafast laser microwelding of glass and other materials with a picosecond laser

Terence Hollister, Jim Bovatsek

Proceedings Volume 11674, Laser-based Micro- and Nanoprocessing XV; 116740I (2021) https://doi.org/10.1117/12.2578777
Event: SPIE LASE, 2021, Online Only

Abstract

Several fields, such as consumer electronics manufacturing, medical device packaging and microfluidics have motivated the development of techniques for adhesiveless bonding of glasses both to other glasses, and to dissimilar materials, such as metals. With the use of ultrafast lasers, through-transmission welding can be achieved using a transparent wavelength to focus tightly at the interface of the materials to be bonded. The combination of absorption initiated by high intensities near the focal point and high pulse repetition frequencies induces heat accumulation. This leads to localized melting and joining of the two materials. Other currently available laser-based methods require introduction of additional material to serve as an absorbing media at the interface to couple energy to the materials and initiate welding. Conversely ultrafast lasers benefit from their inherent ability to induce non-linear absorption localized at the focus. This allows for the potential to develop efficient microwelds that do not age, and require no intermediate layer, preserving transparency in the case of glass-to-glass welding. In this work, we present results for glass-to-glass and glass-to-metal microwelding using a high repetition rate picosecond pulsed laser. Linear joining speeds of 10’s to 100’s of mm/s are demonstrated and their geometries characterized. Welds are evaluated qualitatively by optical inspection through the glass and inspection of prepared cross-sections.

Conference Presentation

Citation Download Citation

Terence Hollister and Jim Bovatsek "Ultrafast laser microwelding of glass and other materials with a picosecond laser", Proc. SPIE 11674, Laser-based Micro- and Nanoprocessing XV, 116740I (5 March 2021); https://doi.org/10.1117/12.2578777

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available