Microjoining of dissimilar materials for optoelectronic and biomedical applications

Reiner Witte; Hans Joachim Herfurth; Ingo Bauer

doi:10.1117/12.478282

15 January 2003 Microjoining of dissimilar materials for optoelectronic and biomedical applications

Reiner Witte, Hans Joachim Herfurth, Ingo Bauer

Proceedings Volume 4979, Micromachining and Microfabrication Process Technology VIII; (2003) https://doi.org/10.1117/12.478282
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

Advanced microsystems for optoelectronic and biomedical applications incorporate a variety of non-metallic materials such as glass, silicon, sapphire and polymers. Examples include switches and multiplexers for fiber-optical data transmission in telecommunications, and innovative implantable microsystems currently being developed to monitor, stimulate and deliver drugs. Laser micromachining has proven to be an effective tool to address specific manufacturing challenges for these devices. Investigations have been conducted on laser ablation for precise localized material removal, laser cutting, and drilling; and application data for a range of relevant materials already exists. In contrast, applications of laser joining are currently limited to microwelding and soldering of metals. The assembly of SMD’s and the sealing of pacemakers are typical examples. This paper will describe the latest achievements in laser microjoining of dissimilar materials. The focus will be on glass, metal and polymer that have been joined using CO₂, Nd:YAG and diode lasers. Results in joining similar and dissimilar materials in different joint configurations will be presented, as well as requirements for sample preparation and fixturing. The potential for applications in the optoelectronic and biomedical sector will be demonstrated.

Citation Download Citation

Reiner Witte, Hans Joachim Herfurth, and Ingo Bauer "Microjoining of dissimilar materials for optoelectronic and biomedical applications", Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); https://doi.org/10.1117/12.478282

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