Integrated optical interconnections on printed circuit boards

Markus Riester; Gregor Langer; Günther Leising

doi:10.1117/12.713937

6 February 2007 Integrated optical interconnections on printed circuit boards

Markus Riester, Gregor Langer, Günther Leising

Proceedings Volume 6478, Photonics Packaging, Integration, and Interconnects VII; 64780A (2007) https://doi.org/10.1117/12.713937
Event: Integrated Optoelectronic Devices 2007, 2007, San Jose, California, United States

Abstract

The development of integrated optical interconnections (IOIs) represents a quantum leap for the functionality of printed circuit boards (PCBs). This new technology will allow highly complex product features and hence, higher product added value. PCBs with optical interconnections will be used where applications call either for very high data streams between components, modules or functional units (e.g. backplanes or multiprocessor boards) or for a space-saving design for interconnection paths (e.g. mobile applications). We discuss the different approaches towards integrating optical waveguides into PCBs and analyze the prerequisites for a transfer to a product. Application scenarios for different markets are presented and steps proposed for required action to deliver solutions that can be driven into a market. In a second section a new and innovative concept for the integration of an optical interconnection system in PCBs is presented. This revolutionary concept is highly supporting the worldwide trend towards miniaturization of not only electronic but also optoelectronic systems in PCBs. The alignment of the optoelectronic components to the waveguides has been addressed by this concept. It is shown that the process will allow the tolerances incurred in the manufacturing processes to be dealt with in a separate process step, allowing existing standard methods for the production of electronic interconnection systems to be used.

Citation Download Citation

Markus Riester, Gregor Langer, and Günther Leising "Integrated optical interconnections on printed circuit boards", Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780A (6 February 2007); https://doi.org/10.1117/12.713937

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