Dr. Markus B. Riester Profile

Dr. Markus B. Riester

CEO at Maris TechCon Technology and R & D Consulting

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Publications (6)

Proceedings Article | 22 February 2013 Paper

Chip-to-board interconnects for high-performance computing

Markus Riester, Ruth Houbertz-Krauss, Sönke Steenhusen

Proceedings Volume 8630, 863002 (2013) https://doi.org/10.1117/12.2008817

KEYWORDS: Optics manufacturing, Waveguides, Optical interconnects, Manufacturing, Optical alignment, Free space optics, Optical components, Connectors, Laser optics, Assembly equipment

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Proceedings Article | 26 October 2012 Paper

IMAGINE project: a low cost, high performance, monolithic passive mm-wave imager front-end

N. Alexander, P. Frijlink, J. Hendricks, E. Limiti, S. Löffler, C. Macdonald, H. Maher, L. Pettersson, D. Platt, P. Rice, M. Riester, D. Schulze, V. Vassilev

Proceedings Volume 8544, 854404 (2012) https://doi.org/10.1117/12.976860

KEYWORDS: Antennas, Radiometry, Diodes, Sensors, Metals, Manufacturing, Imaging systems, Semiconducting wafers, Prototyping, Polymers

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Proceedings Article | 12 February 2009 Paper

Recent advances in planar optical integration

Markus B. K. Riester

Proceedings Volume 7221, 722108 (2009) https://doi.org/10.1117/12.810434

KEYWORDS: Integrated optics, Waveguides, Optics manufacturing, Optical printed circuit boards, Standards development, Manufacturing, Semiconductors, Optical fiber cables, Electronic design automation

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Proceedings Article | 7 March 2007 Paper

Two-photon absorption for the realization of optical waveguides on printed circuit boards

Gregor Langer, Markus Riester

Proceedings Volume 6475, 64750X (2007) https://doi.org/10.1117/12.699382

KEYWORDS: Waveguides, Polymers, Integrated optics, Optoelectronic devices, Absorption, Optical interconnects, Refractive index, Vertical cavity surface emitting lasers, Optics manufacturing, Semiconductor lasers

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The integration of optical interconnections in printed circuit boards (PCBs) is an emerging field that arouses rapidly growing interest worldwide. At present the key issue is to identify a technical concept, which allows for the realization of optical interconnections that are compatible to existing PCB manufacturing processes. Above all, the material in which the optical interconnections are embedded has to withstand increased temperatures and lamination pressures as well as various wet chemistry processes. AT&S uses so-called two-photon absorption (TPA) laser structuring - a rather new and innovative technology - to realize optical circuits in a special polymer layer. In this case a near infrared laser is applied working in the femto-second regime. The high photon density that can be reached in the laser's focus results in a modification of the optical polymer, which is usually photosensitive in the UV-spectrum of light only. In our particular case, the refractive index of the optical polymer is increased. Choosing the right laser intensity and focus propagation speed one achieves a waveguide well embedded within the polymer layer, which has not been affected by the laser. In contrast to one-photon absorption, which only allows a two dimensional respectively lateral modification of a polymer, this technology allows a modification within the volume resulting in 3D-microstructures inside the polymer layer. Apart from the possibility to realize structures in three dimensions, this TPA-technique has additional advantages. First of all, it allows one step fabrication, which reduces costs and production time compared to etching procedures or conventional UV lithography processes. Moreover, this technique allows varying the waveguide's cross section geometry and diameter simply varying size and form of the structuring laser focus. Whereas the realization of optical waveguides is not challenging anymore the coupling of waveguides with optoelectronic components is rather delicate. That is, the waveguide's ends have to be accurately positioned close to the emitting surface of the signal source and the sensing area of the light detector, respectively. Using the TPA technology to structure optical waveguides AT&S has successfully evaluated a powerful method to solve this interface problem for the realization of integrated optical interconnections (IOIs) on PCBs.

Proceedings Article | 6 February 2007 Paper

Integrated optical interconnections on printed circuit boards

Markus Riester, Gregor Langer, Günther Leising

Proceedings Volume 6478, 64780A (2007) https://doi.org/10.1117/12.713937

KEYWORDS: Waveguides, Optics manufacturing, Connectors, Integrated optics, Manufacturing, Standards development, Optical interconnects, Optical alignment, Optical components, Optoelectronics

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Proceedings Article | 30 September 2005 Paper

Laser ablated coupling structures for optical printed circuit boards

Geert Van Steenberge, Peter Geerinck, Markus Riester, Siegfried Pongratz, Peter Van Daele

Proceedings Volume 5956, 59561A (2005) https://doi.org/10.1117/12.622890

KEYWORDS: Mirrors, Waveguides, Laser ablation, Polymers, Optics manufacturing, Cladding, Micromirrors, Manufacturing, Excimer lasers, Metals

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Showing 5 of 6 publications

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