Defect printability studies at SEMATECH

Il-Yong Jang; Ranganath Teki; Vibhu Jindal; Frank Goodwin; Masaki Satake; Ying Li; Danping Peng; Sungmin Huh; Seong-Sue Kim

doi:10.1117/12.2028069

28 June 2013 Defect printability studies at SEMATECH

Il-Yong Jang, Ranganath Teki, Vibhu Jindal, Frank Goodwin, Masaki Satake, Ying Li, Danping Peng, Sungmin Huh, Seong-Sue Kim

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Proceedings Volume 8701, Photomask and Next-Generation Lithography Mask Technology XX; 870111 (2013) https://doi.org/10.1117/12.2028069
Event: Photomask and NGL Mask Technology XX, 2013, Yokohama, Japan

Abstract

We describe SEMATECH’s recent defect printability work categorizing native phase defects by type and dimension using a NXE3100 EUV scanner and DPS (Defect Printability Simulator) software developed by Luminescent Technologies. Since the critical dimension (CD) error on a wafer simulated by the DPS is strongly affected by the multilayer (ML) geometry, it was very important to select the optimal multilayer (ML) growth model for each defect. By investigating the CD results obtained from 27 nm HP node imaging on NXE3100 and comparing those with simulation results, it was clear that reconstructed ML geometry generated by the AFM measurement showed much better simulation accuracy than conformal ML geometry. In order to find a typical ML growth model to predict the best ML geometry for a given dimension and height of defect, we calibrated a general ML growth model with AFM data and obtained ML growth model parameters. Using the fitted ML geometry generated from ML growth model parameters, CD error for 22 nm HP node was simulated and the result showed that conformal ML geometry is good for 24 nm defect simulation while not appropriate for 36 nm defect simulation.

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Il-Yong Jang, Ranganath Teki, Vibhu Jindal, Frank Goodwin, Masaki Satake, Ying Li, Danping Peng, Sungmin Huh, and Seong-Sue Kim "Defect printability studies at SEMATECH", Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 870111 (28 June 2013); https://doi.org/10.1117/12.2028069

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KEYWORDS

Semiconducting wafers

Double positive medium

Photomasks

Calibration

Critical dimension metrology

Data modeling

Extreme ultraviolet

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