Dr. Bruce H. Krohn Profile

Dr. Bruce H. Krohn

at Jet Propulsion Lab

SPIE Involvement:

Author

Publications (2)

Proceedings Article | 23 August 2024 Poster + Paper

The Ariel payload electrical and electronic architecture: a summary of the current design and implementation status

M. Focardi, V. Noce, P. Merola, A. Di Giorgio, S. Ligori, L. Corcione, V. Capobianco, D. Bonino, M. V. Nunez, S. Chiarucci, E. Medinaceli, N. Auricchio, M. Farina, G. Giusi, A. Russi, A. Tortora, L. Serafini, A. Pannocchia, G. Giglio, M. Passerai, M. Verna, C. Del Vecchio Blanco, G. Morgante, J. Ateca, J. Bosch, M. Carmona, A. Casas, J. Gomez, P. Lopez, L. Marti, A. Royo, O. Ruiz, C. Serre, K. Skup, K. Rutkowski, M. Sobiecki, K. Ber, M. Sobolewski, N. Thernstrom, M. Winklera, M. Ciarka, M. Berthé, C. Cara, J. Fontignie, J. Martignac, G. Kaszubiak, N. Leguay, R. Grimoldi, G. Ober, R. Goullioud, W. Holmes, M. Swain, G. Vasisht, H. Cho, J. Mulder, G. Allen, A. Runkle, E. Guzman, M. Weilert, C. Weber, P. Tan, J. Morales, J. Hunacek, A. Rieck, A. Bolduc, K. Aaron, A. Turner, B. Krohn, M. Lew, A. Cillis, R. Foltz, T. Hewagama, M. Loose, M. Crook, M. Hills, G. Gilley, S. Mäkinen, A. Caldwell, G. Bishop, L. Desjonqueres, R. Drummond, P. Eccleston, A. Davidson, P. Umesh, E. Pace, G. Preti, G. Micela, G. Malaguti, G. Tinetti

Proceedings Volume 13092, 1309249 (2024) https://doi.org/10.1117/12.3018741

KEYWORDS: Sensors, Equipment, Field programmable gate arrays, Interfaces, Multiplexers, Design, Control systems, Spectroscopy, Space operations, Telescopes

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Proceedings Article | 29 August 2022 Presentation + Paper

Packaging design and test of cryogenic readout electronics for the Euclid Near Infrared Spectrophotometer

W. Holmes, H. Aghakians, S. Avasapian, A. Bahraman, A. Berg, A. Beyer, E. Boehmer, R. Calvet, S. Cheung, B. Cho, H. Cho, A. Cillis, L. DelCastillo, M. Dickie, G. Delo, M. Farris, A. Feizi, N. Ferraro, L. Fischer, R. Foltz, N. Hambarsoumian, K. Hong, T. Huang, M. Jhabvala, Er. Kan, R. Kopp, B. Krohn, D. Lewis, M. Loose, K. MacNeal, J. Maiten, D. Markley, G. Maldonado, J. Mehta, J. Melendez, A. Morgan, J. Mulder, M. Ngyuen, N. Ovee, M. Pniel, S. Pravdo, D. Randall, J. Riendeau, A. Runkle, M. Runyan, M. Seiffert, M. Skalare, P. Tan, A. Turner, S. Van Nostrand, A. Waczynski, J. Wu

Proceedings Volume 12191, 121911U (2022) https://doi.org/10.1117/12.2629611

KEYWORDS: Cryogenics, Electronics, Reliability, Aluminum, Silicon, Interfaces, Packaging, Analog electronics, Temperature metrology, Gold

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