Technology developed for a 5.5 μm pixel interline transfer CCD family has been incorporated into a new family of highperformance 7.4 μm pixel CCDs, providing significant improvements in several key performance parameters compared to both the 5.5 μm family as well as the previous generation of 7.4 μm pixel products. Smear in the new platform has been reduced to -115 dB, and frame rate has been doubled relative to the previous generation of 7.4 μm pixel products. Dynamic range in normal operation has been improved to 70 dB, and the platform supports a new extended dynamic range mode which provides 82 dB when binning 2 × 2. The new family leverages the package and pin-out configurations used in the 5.5 μm pixel family, allowing easy integration into existing camera designs.
Many applications require accurate color captures in daylight conditions and increased sensitivity for low light
conditions. This is often accomplished by using a mechanical switch to remove the IR cut filter. The sensitivity is
increased at the expense of color accuracy. And a mechanical part is required in the camera. The TRUESENSE
Color Filter Pattern offers an opportunity to get increased sensitivity - using the IR region - while still maintaining
color accuracy. A 2x increase in sensitivity can be achieved over the current TRUESENSE CFA capture which uses
an IR cut filter.
This paper describes the design and performance of a new high-resolution 35 mm format CCD image sensor using an
advanced 5.5 μm interline pixel. The pixels are arranged in a 6576 (H) × 4384 (V) format to support a 3:2 aspect ratio.
This device is part of a family of devices that share a common architecture, pixel performance, and packaging
arrangement. Unique to this device in the family is the implementation of a fast line dump structure and horizontal CCD
lateral overflow drain.
The KODAK TRUESENSE Color Filter Pattern has technology that for the first time is applied to a commercially
available interline CCD. This 2/3" true-HD sensor will be described along with its performance attributes, including
sensitivity improvement as compared to the Bayer CFA version of the same sensor. In addition, an overview of the
system developed for demonstration and evaluation will be provided. Examples of the benefits of the new technology in
specific applications including surveillance and intelligent traffic systems will be discussed.
A new 5.5 &mgr;m pixel interline transfer CCD technology platform has been developed that offers significant improvements in performance while retaining the dynamic range, quantum efficiency, and responsivity available from the previous generation 7.4 µm pixel. Smear has been reduced to -100 dB, and a new quad-output architecture increases the maximum frame rate up to 120 fps for a 1 MPix sensor. This technology is now being deployed across a family of image sensors that share a common package and pin-out, facilitating faster camera design and product commercialization.
Conference Committee Involvement (4)
Image Sensors and Imaging Systems 2015
9 February 2015 | San Francisco, California, United States
Image Sensors and Imaging Systems 2014
5 February 2014 | San Francisco, California, United States
Sensors, Cameras, and Systems for Industrial/Scientific Applications XIV
6 February 2013 | Burlingame, California, United States
Sensors, Cameras, and Systems for Industrial/Scientific Applications XIII
25 January 2012 | Burlingame, California, United States
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.