New circuit architectures and technologies for high-speed electronic and photonic integrated circuits are essential to realize optical interconnects with higher symbol rate. As a consequence of the increasing speeds, close integration and co-design of photonic and electronic chips have become a necessity to realize high-performance transceivers with novel packaging approaches. Extensive co-design also enables the design of new electro-optic architectures to create and process optical signals more efficiently. This paper and presentation will illustrate a number of recent developments of application-specific high-speed electro-optic transceiver circuits including e.g. broadband driver amplifiers, transimpedance amplifiers, analog equalizers and multiplexer circuits for signal generation and reception at 100 Gbaud and beyond. The basic concepts and architectures, technological aspects, design challenges and trade-offs will be discussed.
This paper discusses our progress on high-speed optical transmitters for next generation intra-datacenter interconnects.
Silicon integrated photonic systems have a key role to play in this evolution by allowing compact, fast, innovative and
cost-effective devices to be manufactured in large volumes. Especially silicon Mach-Zehnder modulators are a very
attractive candidate: they are easy to manufacture, easy to use and support both intensity as well as coherent modulation.
Key to the next-generation optical transmitter is not only the very high datarates, but also the very small form-factor and
low power consumption. This requires leveraging electro-optic co-design of driver electronics and optical modulators.
High-speed electronic integrated circuits are essential to the development of new fiber-optic communication systems. As a consequence of the increasing speeds and multi-channel operation, close integration and co-design of photonic and electronic devices have become a necessity to realize high-performance sub-systems. Such co-design on the other hand also enables the design of new electro-optic architectures to create and process multi-level optical signals. This presentation will illustrate a number of recent and ongoing developments in IDLab, an imec research group, from various H2020 projects with a focus on application-specific high-speed electronic transceiver circuits such as driver amplifiers and transimpedance amplifiers (TIAs).
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