Lately, the use of ultrafast in-volume laser-based processing of transparent materials has gained ground as a 3D-printing method of functional materials, photonics devices and high-density storage media. In this talk, we discuss the use of wide-field third-harmonic imaging that offers a non-destructive means for investigating and characterizing laser-written in-volume complex structures. Specifically, the method is used for identifying laser-induced modifications and establishing their taxonomy over a large area of a material. Unlike confocal arrangements, its ability to capture both the direct and scattered signal enables the collection of comprehensive information related to the local laser-induced modifications. Its inline nature allows for in situ monitoring of the material's response to various laser exposure conditions. As future prospect, it offers a pathway towards the implementation of closed-loop control algorithms, guaranteeing the accuracy and consistency of the desired modifications.
Spatial frequency modulated imaging (SPIFI) employs a structured line-shaped illumination, able to resolve beyond conventional resolution limits for coherent light with high speed. It produces image harmonics, with each order carrying a higher resolution. To date this method used rotating reticles to produce the necessary structured illumination, limiting image acquisition to about 100 μs. Here, we introduce a single-shot approach. We show that a super-resolved 1D image can be acquired with a single femtosecond pulse, with potential acquisition rates in the tens of kHz.
In this contribution, we compare the etching behaviour of fused silica machined with a femtosecond laser at three different wavelengths. We use a high-power YAG laser to generate 450 fs-long pulses at the first (1030 nm) and third (343 nm) harmonic. We demonstrate how these new machining techniques can be used to improve the laser-assisted etching in fused silica not only in terms of etching speed, but also in terms of minimal feature size and surface roughness. Processing speeds of several 100 mm/s become possible due to the new regime using fs-UV light.
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