Dr. Sungyoon Ryu Profile

Dr. Sungyoon Ryu

at SAMSUNG Electronics Co Ltd

SPIE Involvement:

Author

Publications (10)

Proceedings Article | 10 April 2024 Presentation + Paper

Non-contact measurement of dopant depth profile with terahertz emission spectroscopy

Kenji Suzuki, Fumikazu Murakami, Inkeun Baek, Mitsunori Numata, Ingi Kim, Ryu Sungyoon, Shinji Ueyama, Yusin Yang, Masayoshi Tonouchi

Proceedings Volume 12955, 1295506 (2024) https://doi.org/10.1117/12.3010681

KEYWORDS: Terahertz radiation, Inspection, Dopants, Transmittance, Terahertz spectroscopy, Optical simulations, Emission spectroscopy, Statistical modeling, Silicon, Pulse signals

Read Abstract +

Proceedings Article | 5 June 2023 Presentation + Paper

Characterization of interface charge traps in PE-TEOS and HDP oxide with different annealing temperatures using time-dependent second-harmonic generation

Ingi Kim, Suhwan Park, Minhwan Seo, Sunhong Jun, Sungyoon Ryu, Sangwoo Bae, Namil Koo, Yusin Yang

Proceedings Volume 12569, 1256904 (2023) https://doi.org/10.1117/12.2657070

KEYWORDS: Oxides, Second harmonic generation, Interfaces, Annealing, Silicon, Electric fields, Electrical properties, Dielectrics, Silicon films, Wafer inspection

Read Abstract +

Proceedings Article | 27 April 2023 Presentation + Paper

Semiconductor device metrology for detecting defective chip due to high aspect ratio-based structures using hyperspectral imaging and deep learning

Sunhong Jun, Wonjun Choi, DongHoon Kim, Hayan Park, Dongmin Kyeon, Kyounghwan Lee, Yong-Ju Jeon, Chaemin Lee, Kwangchul Kim, Jeongsu Ha, Sungyoon Ryu, Younghoon Son, Yongdeok Jung

Proceedings Volume 12496, 124961F (2023) https://doi.org/10.1117/12.2657062

KEYWORDS: Intelligence systems, Semiconducting wafers, Deep learning, 3D metrology, Hyperspectral imaging, Etching, Metrology, 3D modeling, Imaging spectroscopy, Defect detection

Read Abstract +

Proceedings Article | 27 April 2023 Presentation + Paper

Detection of defective areas and hidden weak patterns in the wafer using massive measurement data

DongHoon Kim, Sungyoon Ryu, Sunhong Jun, Heeyoon Han, Wonjun Choi, Yong-Ju Jeon, Hyun Lee, Souk Kim, Younghoon Sohn

Proceedings Volume 12496, 124961Y (2023) https://doi.org/10.1117/12.2657064

KEYWORDS: Semiconducting wafers, Signal detection, Defect detection, Metrology, Signal processing, Semiconductors, Semiconductor manufacturing, Fourier transforms, Fabrication

Read Abstract +

Proceedings Article | 27 April 2023 Presentation + Paper

A study on defect signal improvement using multi-scan optic patch images and new detection algorithm

Sungyoon Ryu, Seunghyeok Son, Chan-Gi Jeon, Sujin Lee, Minho Rim, Yusin Yang, Younghoon Sohn

Proceedings Volume 12496, 124960Y (2023) https://doi.org/10.1117/12.2657845

KEYWORDS: Signal to noise ratio, Defect detection, Inspection, Optical inspection, Semiconducting wafers, Signal detection, Semiconductors, Detection and tracking algorithms, Wafer-level optics, Reconstruction algorithms

Read Abstract +

Proceedings Article | 26 May 2022 Poster + Presentation + Paper

Improved fab-out EDS prediction of memory device using effective accuracy equation

Heeyoon Han, Wansik Nam, Hyeungcheol Mun, Sangbong Lee, Sungyoon Ryu, Younghoon Sohn

Proceedings Volume 12053, 120531S (2022) https://doi.org/10.1117/12.2613619

KEYWORDS: Binary data, Metrology, Distortion, Semiconducting wafers, Semiconductors, Manufacturing, Data conversion, Data modeling, Yield improvement, Optics manufacturing

Read Abstract +

Proceedings Article | 26 May 2022 Presentation + Paper

Diversifying the role of MI in semiconductor manufacturing through new technologies and innovations

Younghoon Sohn, Sungyoon Ryu, Jaehyung Ahn, Souk Kim

Proceedings Volume 12053, 120530X (2022) https://doi.org/10.1117/12.2612710

KEYWORDS: Semiconductors, Inspection, Data processing, Semiconductor manufacturing, Scanning electron microscopy, New and emerging technologies, High volume manufacturing

Read Abstract +

Proceedings Article | 26 May 2022 Presentation + Paper

A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data

Sungyoon Ryu, Dong Hoon Kim, Sunhong Jun, Suho Ryu, JaeHyung Ahn, Hyun Lee, Kwang-Eun Kim, Yusin Yang, Younghoon Sohn

Proceedings Volume 12053, 1205302 (2022) https://doi.org/10.1117/12.2613631

KEYWORDS: Semiconducting wafers, 3D metrology, Inspection, Metrology, Ellipsometry, 3D modeling, Detection and tracking algorithms, Wafer-level optics, Semiconductors, Manufacturing

Read Abstract +

Proceedings Article | 20 June 2021 Presentation + Paper

Angstrom-accuracy multilayer thickness determination using optical metrology and machine learning

Hyunsoo Kwak, Sungyoon Ryu, Suil Cho, Junmo Kim, Yusin Yang, Jungwon Kim

Proceedings Volume 11782, 117820U (2021) https://doi.org/10.1117/12.2592216

KEYWORDS: Machine learning, Data modeling, Transmission electron microscopy, Statistical modeling, Semiconductors, Optical metrology, 3D metrology, Target detection, Ultrafast phenomena, Spectroscopic ellipsometry

Read Abstract +

Proceedings Article | 13 March 2018 Presentation + Paper

Spectroscopic vector analysis for fast pattern quality monitoring

Younghoon Sohn, Sungyoon Ryu, Chihoon Lee, Yusin Yang

Proceedings Volume 10585, 105851J (2018) https://doi.org/10.1117/12.2296448

KEYWORDS: Critical dimension metrology, Phase shifts, Semiconductors, Spectroscopic ellipsometry, Scanning probe microscopy, Semiconducting wafers, Data modeling, Spectroscopes, Time metrology, Scanning electron microscopy

Read Abstract +

Showing 5 of 10 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years