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Weiyang Zhu
at Cadence Design Systems, Inc.
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Publications (1)
Proceedings Article | 26 May 2022 Presentation + Paper
Wafer level analysis and simulation of back end of line chemical mechanical polishing processes
Ushasree Katakamsetty, Stefan Nikolaev Voykov, Sascha Bott, Sam Nakagawa, Tamba Tugbawa, Aaron Gower-Hall, Brian Lee, Jansen Chee, Henry Geng, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
Proceedings Volume 12052, 1205212 (2022) https://doi.org/10.1117/12.2616078
KEYWORDS: Chemical mechanical planarization, Semiconducting wafers, Data modeling, Calibration, Dysprosium, Back end of line, Polishing, Design for manufacturing, Metals, Chemical reactions
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