Dr. Yun T. Zheng Profile

Dr. Yun T. Zheng

Senior Engineer at NASA Goddard Space Flight Ctr

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Publications (13)

Proceedings Article | 28 August 2010 Paper

Non-contact stiffness measurement of a suspended single walled carbon nanotube devices

Yun Zheng, Chanmin Su, Stephanie Getty

Proceedings Volume 7764, 77640K (2010) https://doi.org/10.1117/12.861289

KEYWORDS: Electric field sensors, Sensors, Single walled carbon nanotubes, Gold, Silicon, Microelectromechanical systems, Electrodes, Oxides, Doppler effect, Calibration

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Proceedings Article | 12 May 2009 Paper

Fabrication of a nanoscale electric field sensor

Yun Zheng, Todd King, Daniel Stewart, Stephanie Getty

Proceedings Volume 7318, 731815 (2009) https://doi.org/10.1117/12.818958

KEYWORDS: Electric field sensors, Sensors, Gold, Microelectromechanical systems, Silicon, Electrodes, Packaging, Single walled carbon nanotubes, Scanning electron microscopy, Calibration

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Proceedings Article | 20 September 2007 Paper

Microshutter array system for James Webb Space Telescope

M. Li, T. Adachi, C. Allen, S. Babu, S. Bajikar, M. Beamesderfer, R. Bradley, N. Costen, Kevin Denis, A. Ewin, D. Franz, L. Hess, R. Hu, K. Jackson, M. Jhabvala, D. Kelly, T. King, G. Kletetschka, A. Kutyrev, B. Lynch, S. Meyer, T. Miller, S. Moseley, V. Mikula, B. Mott, L. Oh, J. Pontius, D. Rapchun, C. Ray, S. Schwinger, P. Shu, R. Silverberg, W. Smith, S. Snodgrass, D. Sohl, L. Sparr, R. Steptoe-Jackson, R. Thate, F. Wang, L. Wang, Y. Zheng, C. Zincke

Proceedings Volume 6687, 668709 (2007) https://doi.org/10.1117/12.734152

KEYWORDS: Camera shutters, Electrodes, Indium, Magnetism, James Webb Space Telescope, Silicon, Optical fabrication, Metals, Space telescopes, Sensors

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Proceedings Article | 3 May 2007 Paper

Complex MEMS device: microshutter array system for space applications

Mary Li, Tomoko Adachi, Christine Allen, Sachi Babu, Sateesh Bajikar, Michael Beamesderfer, Ruth Bradley, Kevin Denis, Nick Costen, Audrey Ewin, Dave Franz, Larry Hess, Ron Hu, Kamili Jackson, Murzy Jhabvala, Dan Kelly, Todd King, Gunther Kletetschka, Alexander Kutyrev, Barney Lynch, Timothy Miller, Harvey Moseley, Vilem Mikula, Brent Mott, Lance Oh, James Pontius, Dave Rapchun, Chris Ray, Knute Ray, Eric Schulte, Scott Schwinger, Peter Shu, Robert Silverberg, Wayne Smith, Steve Snodgrass, David Sohl, Leroy Sparr, Rosalind Steptoe-Jackson, Veronica Valeriano, Liqin Wang, Yun Zheng, Chris Zincke

Proceedings Volume 6556, 655602 (2007) https://doi.org/10.1117/12.721502

KEYWORDS: Camera shutters, Electrodes, Magnetism, Indium, Silicon, James Webb Space Telescope, Optical fabrication, Metals, Microelectromechanical systems, Space telescopes

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Proceedings Article | 20 December 2006 Open Access

MEMS microshutter arrays for James Webb Space Telescope

Mary Li, Tomoko Adachi, Christine Allen, Sachi Babu, Sateesh Bajikar, Michael Beamesderfer, Ruth Bradley, Kevin Denis, Nick Costen, Audrey Ewin, David Franz, Larry Hess, Ron Hu, Kamili Jackson, Murzy Jhabvala, Dan Kelly, Todd King, Gunther Kletetschka, Alexander Kutyrev, Barney Lynch, Timothy Miller, Harvey Moseley, Vilem Mikula, Brent Mott, Lance Oh, James Pontius, David Rapchun, Chris Ray, Eric Schulte, Scott Schwinger, Peter Shu, Robert Silverberg, Wayne Smith, Steve Snodgrass, David Sohl, Leroy Sparr, Rosalind Steptoe-Jackson, Valeriano Veronica, Liqin Wang, Yun Zheng, Chris Zincke

Proceedings Volume 6415, 64150B (2006) https://doi.org/10.1117/12.706308

KEYWORDS: Camera shutters, Electrodes, Indium, Magnetism, Silicon, James Webb Space Telescope, Optical fabrication, Metals, Microelectromechanical systems, Space telescopes

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Proceedings Article | 1 July 2005 Paper

Thermal-stress control of microshutter arrays in cryogenic applications for the James Webb Space Telescope

Daniel Kelly, Wen-Hsien Chuang, Larry Hess, Ron Hu, Murzy Jhabvala, Todd King, Mary Li, James Loughlin, S. Harvey Moseley, Christopher Ray, Yun Zheng

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.608754

KEYWORDS: Camera shutters, Electrodes, Metals, Silicon, Cryogenics, James Webb Space Telescope, Aluminum, Magnetism, Silicon films, Spectroscopy

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Proceedings Article | 23 February 2005 Paper

Microshutter array development for the James Webb space telescope

Mary Li, Nadine Acuna, Edward Amatucci, Michael Beamesderfer, Ray Boucarut, Sachi Babu, Sateesh Bajikar, Audrey Ewin, Rainer Fettig, David Franz, Larry Hess, Ron Hu, Murzy Jhabvala, Daniel Kelly, Todd King, Gunther Kletetschka, Carl Kotechi, Alexander Kutyrev, James Loughlin, Bernard Lynch, Harvey Moseley, Brent Mott, Bill Newell, Lance Oh, David Rapchun, Chris Ray, Carol Sappington, Eric Schulte, Scott Schwinger, Wayne Smith, Steve Snodgrass, Leroy Sparr, Rosalind Steptoe-Jackson, Liqin Wang, Yun Zheng, Chris Zincke

Proceedings Volume 5650, (2005) https://doi.org/10.1117/12.581861

KEYWORDS: Camera shutters, Electrodes, Silicon, Metals, Magnetism, James Webb Space Telescope, Optical fabrication, Microelectromechanical systems, Semiconducting wafers, Reactive ion etching

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Proceedings Article | 16 January 2003 Paper

Microshutter arrays for near-infrared applications on the James Webb Space Telescope

Mary Li, Alex Bier, Rainer Fettig, David Franz, R. Hu, T. King, Alexander Kutyrev, Bernard Lynch, Samuel Moseley, David Mott, David Rapchun, Robert Silverberg, Wayne Smith, L. Wang, Yun Zheng, C. Zinke

Proceedings Volume 4981, (2003) https://doi.org/10.1117/12.476285

KEYWORDS: Camera shutters, Electrodes, Metals, Silicon, Photomasks, James Webb Space Telescope, Magnetism, Semiconducting wafers, Microelectromechanical systems, Oxides

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Proceedings Article | 14 November 2002 Paper

Film stress of microshutter arrays for the James Webb Space Telescope

Yun Zheng, Shu-Fan Cheng, Rainer Fettig, Mary Li, Brent Mott, Harvey Moseley

Proceedings Volume 4935, (2002) https://doi.org/10.1117/12.476118

KEYWORDS: Iron, Camera shutters, Silicon, Aluminum, James Webb Space Telescope, Sputter deposition, Spectroscopy, Magnetism, Space telescopes, Semiconducting wafers

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Proceedings Article | 16 July 2002 Paper

Planarization for the integration of CMOS and micromirror arrays

Yun Zheng, Mitra Dutta, Carl Kotecki, Christian Zincke

Proceedings Volume 4689, (2002) https://doi.org/10.1117/12.473435

KEYWORDS: Semiconducting wafers, Coating, Aluminum, Micromirrors, Mirrors, Glasses, Wafer testing, Silicon, Etching, Reactive ion etching

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Proceedings Article | 19 April 2002 Paper

Packaging of large-area individually addressable micromirror arrays for the next generation space telescope

GuoQuan Lu, J. Calata, S. Wen, Sanghamitra Dutta, Yun Zheng, C. Stahl, Peter Shu

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462852

KEYWORDS: Silicon, Packaging, Microelectromechanical systems, Space telescopes, Micromirrors, Distortion, Spectroscopy, Photomasks, Semiconducting wafers, Wafer bonding

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One of NASA's challenging projects for advancing the exploration of space is the development and deployment of the Next Generation Space Telescope (NGST) for superseding the existing Hubble Space Telescope. The NGST will be equipped with several camera/spectrometer systems including a 0.6 to 5 micron Multi-Object-Spectrometer. To selectively direct light rays from different regions of space into the spectrometer, an option is to use individually addressable micro-electro-mechanical-mirror arrays serving as the slit mask for the spectrometer. The NASA team at Goddard Space Flight Center has designed an integrated micro-mirror array/CMOS driver chip that can meet the system requirements. The fabrication and testing of prototype chips have yielded promising results. To build the entire MEMS- based slit mask, a design requires accurate placement and alignment of four large (at least 9 cm X 9 cm) pieces of the integrated chips in a 2X2 mosaic pattern. In addition, the mask will have to function at temperatures below 40 K. These requirements pose a serious challenge to the packaging of these integrated MEMS chips. In this paper, we discuss a concept for attaching and aligning the large- area MEMS chips into the 2X2 mask and interconnecting it to the rest of the system. The concept makes use of the flip-chip technology to bump-bond the large chips onto a silicon substrate such that the concern for global thermo- mechanical stresses due to mismatched coefficients of thermal expansion between chip and substrate is eliminated. It also makes use of the restoring force of the solder bumps during reflow to self-align the chips. A critical experiment involving the use of 'mechanical' chips with two-dimensional arrays of bonding pads was carried out to evaluate the feasibility of the packaging concept. Preliminary results indicate that the chips can be attached to form a closely packed mosaic pattern with a relative tilt angle between the chips to less than 0.05 degree, which is within the system specifications. Modeling results of the thermo-mechanical stresses gave small distortion as a result local CTE mismatch between the solder bump and silicon when the package is cooled from the solder reflow temperature down to 40 degrees Kelvin.

Proceedings Article | 30 April 2001 Paper

Fabrication of microshutter arrays for space application

Mary Li, I. Aslam, Audrey Ewin, Rainer Fettig, David Franz, Carl Kotecki, Alexander Kutyrev, Samuel Moseley, Carlos Monroy, David Mott, Yun Zheng

Proceedings Volume 4407, (2001) https://doi.org/10.1117/12.425314

KEYWORDS: Camera shutters, Etching, Semiconducting wafers, Silicon, Deep reactive ion etching, Magnetism, Electrodes, Oxides, Space telescopes, Microelectromechanical systems

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Proceedings Article | 22 May 1995 Paper

Thin film composite actuators

Quanmin Su, Taesung Kim, Yun Zheng, Manfred Wuttig

Proceedings Volume 2441, (1995) https://doi.org/10.1117/12.209792

KEYWORDS: Composites, Annealing, Thin films, Actuators, Silicon, Interfaces, Shape memory alloys, Magnetostrictive materials, Switches, Magnetism

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