SVG 157-nm lithography technical review

Thomas J. Fahey; James A. McClay; Matthew E. Hansen; Bruce A. Tirri; Matthew Lipson

doi:10.1117/12.435789

14 September 2001 SVG 157-nm lithography technical review

Thomas J. Fahey, James A. McClay, Matthew E. Hansen, Bruce A. Tirri, Matthew Lipson

Proceedings Volume 4346, Optical Microlithography XIV; (2001) https://doi.org/10.1117/12.435789
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

SVG Lithography (SVGL) has established and is executing a comprehensive program for the development of an advanced 157 nm Lithography Exposure System capable of processing 70 nm critical dimensions for three years now. This paper presents the approach, and details the present state of the challenges in the development of 157 nm lithography. It also describes the SVGL 157 nm program approach and provides some insight into the progress made to date addressing the challenges. Specific attention is paid to addressing 3 critical areas: Molecular contamination/purging, optical coating, and optical surfacing.

Citation Download Citation

Thomas J. Fahey, James A. McClay, Matthew E. Hansen, Bruce A. Tirri, and Matthew Lipson "SVG 157-nm lithography technical review", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); https://doi.org/10.1117/12.435789

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