Dr. Daniel C. Wack
Sr Director, Adv Dev
SPIE Involvement:
Author
Area of Expertise:
Optical physics , Computational physics , Detector technology , Optical system engineering , Program Management , Business Development
Profile Summary

Dan Wack has a PhD in Applied Physics from Cornell University, and a BA in Physics from Amherst College.

Currently, Dan is Senior Director of Advanced Technology in the Reticle Inspection Division at KLA-Tencor, and since 2008 has been Program Manager for the development of actinic EUV mask inspection systems. Dan has held multiple engineering leadership positions in new product development since joining Tencor in 1995, contributed technical assessments in M&A engagements, and contributed inventions leading to over 30 US patents.

Prior to joining Tencor, Dan was an Engineering Manager and Research Scientist at ADAC Labs and GE Medical Systems, developing PET scanners and gamma cameras for diagnostic radiology in nuclear medicine.

Dan held computational physics and systems engineering positions in GE Aerospace and the Institute for Defense Analyses, focused on long-range atmospheric transmission in estimating performance limits of tactical and strategic IR sensor systems.

At Cornell, Dan pursued thesis research in Watt Webb's group using synchrotron radiation diffraction analysis of structural and statistical properties of lyotropic smectic liquid crystal phases formed by lecithin.
Publications (6)

SPIE Journal Paper | 8 March 2022 Open Access
Larissa Juschkin, Daniel Wack
JM3, Vol. 21, Issue 02, 021204, (March 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.2.021204
KEYWORDS: Photomasks, Inspection, Extreme ultraviolet, Sensors, Imaging systems, Semiconducting wafers, Interference (communication), Signal detection, Scanners, Signal to noise ratio

Proceedings Article | 25 May 2010 Paper
Proceedings Volume 7748, 77481Y (2010) https://doi.org/10.1117/12.864093
KEYWORDS: Inspection, Photomasks, Extreme ultraviolet lithography, Extreme ultraviolet, Semiconducting wafers, Modulation, Lithography, Image enhancement, Reflectivity, Polarization

Proceedings Article | 20 March 2010 Paper
Proceedings Volume 7636, 76360V (2010) https://doi.org/10.1117/12.850766
KEYWORDS: Inspection, Photomasks, Extreme ultraviolet lithography, Extreme ultraviolet, Semiconducting wafers, Modulation, Lithography, Image enhancement, Reflectivity, Polarization

Proceedings Article | 23 March 2009 Paper
G. Vera Zhuang, Steven Spielman, John Fielden, Daniel Wack, Leonid Poslavsky, Benjamin Bunday
Proceedings Volume 7272, 72720L (2009) https://doi.org/10.1117/12.813007
KEYWORDS: Line width roughness, Critical dimension metrology, Light scattering, Line edge roughness, Scattering, Semiconducting wafers, Scanning electron microscopy, Metrology, Scatterometry, Diffraction

Proceedings Article | 24 March 2008 Paper
Daniel Wack, John Hench, Leonid Poslavsky, John Fielden, Vera Zhuang, Walter Mieher, Ted Dziura
Proceedings Volume 6922, 69221N (2008) https://doi.org/10.1117/12.772997
KEYWORDS: Metrology, Process control, Etching, Critical dimension metrology, Systems modeling, Spectroscopy, Double patterning technology, Optical lithography, Performance modeling, Reflectometry

Showing 5 of 6 publications
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