Mr. Min Hong Profile

Min Hong

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Publications (1)

Proceedings Article | 10 April 2024 Poster

Validation of high-throughput AFM for copper pad metrology in high volume manufacturing

Kyung Souk Yi, Min Hong, Jiyeon Kim, Eunpa Kim, Kwang Soo Kim, Kyong Wook Noh, Su-Young Lee, Myungjun Lee, Yusin Yang, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Nelda Antonovaité, Niranjan Saikumar, Rudolf Wilhelm, Hamed Sadeghian

Proceedings Volume 12955, 129552U (2024) https://doi.org/10.1117/12.3010488

KEYWORDS: Semiconducting wafers, High volume manufacturing, Metrology, Copper, Chemical mechanical planarization, Surface finishing, Semiconductor manufacturing, Process control, Miniaturization, Atomic force microscopy

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