Dr. M. Dalil Rahman Profile

Dr. M. Dalil Rahman

Senior Staff Scientist at EMD Electronics

SPIE Involvement:

Author

Publications (51)

Proceedings Article | 7 April 2017 Paper

Spin-on metal oxide materials for N7 and beyond patterning applications

G. Mannaert, E. Altamirano-Sanchez, T. Hopf, F. Sebaai, C. Lorant, C. Petermann, S.-E. Hong, S. Mullen, E. Wolfer, D. Mckenzie, H. Yao, D. Rahman, J.-Y. Cho, M. Padmanaban, D. Piumi

Proceedings Volume 10149, 101490T (2017) https://doi.org/10.1117/12.2264323

KEYWORDS: Etching, Metals, Optical lithography, Photomasks, Plasma, System on a chip, Oxides, Contamination, Reflectivity, Silicon

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Proceedings Article | 25 March 2016 Paper

Spin-on metal oxide materials with high etch selectivity and wet strippability

Huirong Yao, Salem Mullen, Elizabeth Wolfer, Douglas McKenzie, Dalil Rahman, JoonYeon Cho, Munirathna Padmanaban, Claire Petermann, SungEun Hong, YoungJun Her

Proceedings Volume 9779, 97791O (2016) https://doi.org/10.1117/12.2220293

KEYWORDS: Resistance, Oxygen, Silicon, Semiconducting wafers

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Proceedings Article | 20 March 2015 Paper

Progress in spin-on metal oxide hardmask materials for filling applications

Huirong Yao, Alberto Dioses, Salem Mullen, Elizabeth Wolfer, Douglas McKenzie, Dalil Rahman, JoonYeon Cho, Munirathna Padmanaban, Claire Petermann, YoungJun Her, Yi Cao

Proceedings Volume 9425, 942518 (2015) https://doi.org/10.1117/12.2085811

KEYWORDS: Metals, Etching, Oxides, Photomasks, Dielectrics, Resistance, Semiconducting wafers, Coating, Silicon, Plasma etching

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Proceedings Article | 27 March 2014 Paper

Development of spin-on-carbon hard mask for advanced node

Takanori Kudo, M. Dalil Rahman, Douglas McKenzie, Clement Anyadiegwu, Sandra Doerrenbaecher, Wolfgang Zahn, Munirathna Padmanaban

Proceedings Volume 9051, 90511X (2014) https://doi.org/10.1117/12.2046293

KEYWORDS: System on a chip, Polymers, Carbon, Etching, Silicon, Photomasks, Plasma etching, Semiconducting wafers, Resistance, Coating

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Proceedings Article | 29 March 2013 Paper

New spin-on metal hardmask materials for lithography processes

Huirong Yao, Salem Mullen, Elizabeth Wolfer, Dalil Rahman, Clement Anyadiegwu, Douglas Mckenzie, Alberto Dioses, Joonyeon Cho, Munirathna Padmanaban

Proceedings Volume 8682, 86820S (2013) https://doi.org/10.1117/12.2011226

KEYWORDS: Etching, Metals, Semiconducting wafers, Photomasks, Silicon, Coating, Oxides, Extreme ultraviolet lithography, Lithography, Photoresist materials

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Proceedings Article | 11 December 2009 Paper

Image reversal trilayer materials and processing

David Abdallah, Kazunori Kurosawa, Elizabeth Wolfer, Victor Monreal, M. Dalil Rahman, DongKwan Lee, Mark Neisser, Ralph Dammel

Proceedings Volume 7520, 75200L (2009) https://doi.org/10.1117/12.837017

KEYWORDS: Etching, Image processing, Photoresist materials, Photomasks, Carbon, Fourier transforms, Lithography, Silicon, Coating, Oxygen

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Proceedings Article | 1 April 2009 Paper

Reworkable spin-on trilayer materials: optimization of rework process and solutions for manufacturability

Ruzhi Zhang, Allen Timko, John Zook, Yayi Wei, Lyudmila Pylneva, Yi Yi, Chenghong Li, Hengpeng Wu, Dalil Rahman, Douglas McKenzie, Clement Anyadiegwu, Ping-Hung Lu, Mark Neisser, Ralph Dammel, Ron Bradbury, Timothy Lee

Proceedings Volume 7273, 72732O (2009) https://doi.org/10.1117/12.814708

KEYWORDS: Semiconducting wafers, Silicon, Coating, Inspection, Manufacturing, Chemistry, Fourier transforms, Defect inspection, Polymers, Photoresist materials

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Trilayer stacks with alternating etch selectivity were developed and extensively investigated for high NA immersion lithography at 32nm node and beyond. The conveyance of pattern transfer function from photoresist to Si-containing bottom anti-reflective coating (Si-BARC) and carbonrich underlayer hard-mask (UL) elegantly solved the small etch budget issue for ultra-thin photoresists in immersion lithography. However, due to the hybrid nature of Si-BARC, many different behaviors were observed in comparison to conventional BARC. Lithographic performance, stability, and reworkability were among the most challenging issues for trilayer scheme. Despite of the rapid improvement in lithographic performance and stability of trilayer materials reported by several papers, the rework and cleaning of trilayer materials by wet chemistry remained a challenging problem for manufacturability. The dual function requirement of reflection control and pattern transfer (i.e. hard-masking) for spin-on Si-BARC mandates hybrid materials. Si-BARC containing both organic moiety and inorganic backbone were extensively studied and demonstrated excellent performance. However, the hybrid nature of Si-BARC necessitates the revisit of different wet chemistries and process adjustment is essential to achieve desirable results. In addition, the similarity in chemical structures between Si-BARC and low-κ dielectrics demands subtle rework differentiation by wet chemistry from a chemistry point of view. In our development, we strived to identify rework solutions for trilayer materials in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications. Rework solutions including diluted HF, Piranha, and low-κ compatible strippers were extensively investigated. The optimization of solution mixture ratios and processing conditions was systematically studied. Thorough defect inspection after rework was performed to ensure the readiness for manufacturability. Extensive Piranha rework study on stack wafers and monitor wafers were carried out and excellent results are reported.

Proceedings Article | 4 December 2008 Paper

Spin-on trilayer scheme: enabling materials for extension of ArF immersion lithography to 32nm node and beyond

Ruzhi Zhang, Allen Timko, Lyudmila Pylneva, Jennifer Loch, Hengpeng Wu, David Abdallah, Richard Collett, Yayi Wei, Dalil Rahman, Douglas McKenzie, Ping-Hung Lu, Mark Neisser

Proceedings Volume 7140, 71402T (2008) https://doi.org/10.1117/12.804748

KEYWORDS: Silicon, Etching, Reflectivity, Semiconducting wafers, Polymers, Lithography, Photoresist materials, Immersion lithography, Coating, Fourier transforms

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SPIE Journal Paper | 1 July 2008

Novolak resins and the microelectronic revolution

Stanley Wanat, Robert Plass, M. Dalil Rahman

JM3, Vol. 7, Issue 03, 033008, (July 2008) https://doi.org/10.1117/12.10.1117/1.2968268

KEYWORDS: Metals, Microelectronics, Photoresist materials, Ion exchange, Electroluminescence, Photoresist developing, Patents, Photoresist processing, Picture Archiving and Communication System, Dielectrics

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Proceedings Article | 15 April 2008 Paper

Etching spin-on trilayer masks

David Abdallah, Shinji Miyazaki, Aritaka Hishida, Allen Timko, Douglas McKenzie, Dalil Rahman, WooKyu Kim, Lyudmila Pylneva, Hengpeng Wu, Ruzhi Zhang, Ping-Hung Lu, Mark Neisser, Ralph Dammel

Proceedings Volume 6923, 69230U (2008) https://doi.org/10.1117/12.772691

KEYWORDS: Etching, Oxygen, Carbon, Semiconducting wafers, Reactive ion etching, Photomasks, Photoresist materials, Fourier transforms, Silicon, Lithography

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Proceedings Article | 9 April 2007 Paper

Novel diamantane polymer platform for enhanced etch resistance

Munirathna Padmanaban, Srinivasan Chakrapani, Guanyang Lin, Takanori Kudo, Deepa Parthasarathy, Dalil Rahman, Clement Anyadiegwu, Charito Antonio, Ralph Dammel, Shenggao Liu, Frederick Lam, Anthony Waitz, Masao Yamagchi, Takayuki Maehara

Proceedings Volume 6519, 65190G (2007) https://doi.org/10.1117/12.713111

KEYWORDS: Polymers, Etching, Dry etching, Resistance, Lithography, Photoresist materials, 193nm lithography, Line width roughness, Molecules, Polymerization

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Proceedings Article | 2 April 2007 Paper

Spin-on trilayer approaches to high NA 193nm lithography

D. Abdallah, D. McKenzie, A. Timko, A. Dioses, F. Houlihan, D. Rahman, S. Miyazaki, R. Zhang, W. Kim, H. Wu, L. Pylneva, P.-H. Lu, M. Neisser, R. Dammel, J. Biafore

Proceedings Volume 6519, 65190M (2007) https://doi.org/10.1117/12.712700

KEYWORDS: Silicon, Etching, Fourier transforms, Carbon, Lithography, Antireflective coatings, Reflectivity, Semiconducting wafers, Photomasks, Silicon carbide

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Proceedings Article | 11 April 2006 Paper

Performance of a dry 193nm resist under wet conditions

Munirathna Padmanaban, Andrew Romano, Guanyang Lin, Simon Chiu, Allen Timko, Frank Houlihan, Dalil Rahman, S. Chakrapani, T. Kudo, Ralph Dammel, Karen Turnquest, Georgia Rich, Scott Schuetter, Timothy Shedd, Gregory Nellis

Proceedings Volume 6153, 615307 (2006) https://doi.org/10.1117/12.659392

KEYWORDS: Thin film coatings, Lithography, Polymers, Line edge roughness, Semiconducting wafers, Photoresist processing, Line width roughness, Immersion lithography, Photoresist materials, Fourier transforms

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Proceedings Article | 11 April 2006 Paper

193-nm resist composition using hybrid copolymers of cycloolefin/maleic anhydride (COMA)/methacrylate

M. Dalil Rahman, Srivanisan Chakrapani, Clement Anyadiegwu, Guanyang Lin, Allen Timko, Frank Houlihan, David Rentkiewicz, Takanori Kudo, Douglas McKenzie, Ralph Dammel, Munirathna Padmanaban

Proceedings Volume 6153, 615327 (2006) https://doi.org/10.1117/12.658671

KEYWORDS: Polymers, Lithography, Line edge roughness, Semiconducting wafers, Photoresist processing, Critical dimension metrology, Polymer thin films, Etching, Lithographic illumination, Polymerization

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Proceedings Article | 29 March 2006 Paper

Study of the effect of amine additives on LWR and LER

Francis Houlihan, David Rentkiewicz, Guanyang Lin, Dalil Rahman, Douglas Mackenzie, Allen Timko, Takanori Kudo, Clement Anyadiegwu, Muthiah Thiyagarajan, Simon Chiu, Andrew Romano, Ralph Dammel, Munirathna Padmanaban

Proceedings Volume 6153, 615317 (2006) https://doi.org/10.1117/12.659465

KEYWORDS: Line edge roughness, Line width roughness, Polymers, Semiconducting wafers, Lithography, Transistors, Diffusion, Photoresist processing, Critical dimension metrology, Control systems

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Proceedings Article | 29 March 2006 Paper

Versatility in lithographic performance of advanced 193 nm contact hole resist

Takanori Kudo, Guanyang Lin, Dongkwan Lee, Dalil Rahman, Allen Timko, Douglas Mckenzie, Clement Anyadiegwu, Simon Chiu, Frank Houlihan, David Rentkiewicz, Ralph Dammel, Munirathna Padmanaban, John Biafore

Proceedings Volume 6153, 61532C (2006) https://doi.org/10.1117/12.659439

KEYWORDS: Polymers, Lithography, Semiconducting wafers, Photomasks, Resolution enhancement technologies, Photoresist processing, Electroluminescence, Critical dimension metrology, Scanning electron microscopy, Etching

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Proceedings Article | 4 May 2005 Paper

Effect of hard bake process on LER

Munirathna Padmanaban, David Rentkiewicz, SangHo Lee, Chisun Hong, Dongkwan Lee, Dalil Rahman, Raj Sakamuri, Ralph Dammel

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.604401

KEYWORDS: Line edge roughness, Photoresist processing, Polymers, Line width roughness, Semiconducting wafers, Critical dimension metrology, Cadmium, Chemically amplified resists, Transistors, Optical lithography

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Proceedings Article | 14 May 2004 Paper

PEB sensitivity studies of ArF resists: II. Polymer and solvent effects

Chi-Sun Hong, Sang-Ho Lee, Woo-Kyu Kim, Takanori Kudo, Allen Timko, Douglas Mckenzie, Clement Anyadiegwu, Dalil Rahman, Guanyang Lin, Ralph Dammel, Munirathna Padmanaban

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.537931

KEYWORDS: Polymers, Critical dimension metrology, Photoresist processing, Etching, Resistance, Lithography, Semiconducting wafers, Resist chemistry, Line edge roughness, Dry etching

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Proceedings Article | 14 May 2004 Paper

A study on the dissolution inhibition of poly norbornene hexafluoroisopropanol in aqueous base solutions

Medhat Toukhy, Joseph Oberlander, Dalil Rahman, Francis Houlihan

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.537077

KEYWORDS: Polymers, Hydrogen, Molecules, Lithography, 193nm lithography, Molybdenum, Absorption, Silicon, Semiconducting wafers, Solids

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Proceedings Article | 12 June 2003 Paper

Performance of imide and methide onium PAGs in 193-nm resist formulations

Munirathna Padmanaban, Ralph Dammel, SangHo Lee, Woo-Kyu Kim, Takanori Kudo, Douglas McKenzie, Dalil Rahman

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.487738

KEYWORDS: Polymers, Lithography, 193nm lithography, Semiconducting wafers, Argon, Chemically amplified resists, Fluorine, Diffusion, Cadmium sulfide, Etching

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Proceedings Article | 12 June 2003 Paper

PEB sensitivity studies of ArF resist

SangHo Lee, Woo-Kyu Kim, Dalil Rahman, Takanori Kudo, Allen Timko, Clement Anyadiegwu, Douglas McKenzie, Takashi Kanda, Ralph Dammel, Munirathna Padmanaban

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485183

KEYWORDS: Lithography, Critical dimension metrology, Line edge roughness, Polymers, Photoresist processing, Semiconducting wafers, Coating, Rutherfordium, Diffusion, Scanning electron microscopy

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Proceedings Article | 24 July 2002 Paper

Illumination, acid diffusion, and process optimization considerations for 193-nm contact hole resists

Takanori Kudo, Eric Alemy, Ralph Dammel, Woo-Kyu Kim, Sang-Ho Lee, Seiya Masuda, Douglas McKenzie, Dalil Rahman, Andrew Romano, Munirathna Padmanaban, Jun-Sung Chun, Jae Chang Jung, Sung-Koo Lee, Ki-Soo Shin, Hyeong-Soo Kim

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474214

KEYWORDS: Photomasks, Polymers, Lithography, Binary data, Diffusion, Scanning electron microscopy, Halftones, Photoresist processing, Coherence (optics), Monochromatic aberrations

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Proceedings Article | 24 July 2002 Paper

E-beam curing effects on the etch and CD-SEM stability of 193-nm resists

Munirathna Padmanaban, Eric Alemy, Ralph Dammel, Woo-Kyu Kim, Takanori Kudo, Sang-Ho Lee, Douglas McKenzie, Aldo Orsi, Dalil Rahman, Wan-Lin Chen, Reza Sadjadi, William Livesay, Matthew Ross

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474262

KEYWORDS: Etching, Photoresist processing, Scanning electron microscopy, Surface roughness, FT-IR spectroscopy, Electron beams, Semiconducting wafers, Polymers, Chemistry, Oxides

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Proceedings Article | 24 July 2002 Paper

Cycloolefin/cyanoacrylate (COCA) copolymers for 193-nm and 157-nm lithography

Ralph Dammel, Raj Sakamuri, Sang-Ho Lee, Dalil Rahman, Takanori Kudo, Andrew Romano, Larry Rhodes, John-Henry Lipian, Cheryl Hacker, Dennis Barnes

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474196

KEYWORDS: Polymers, Lithography, Absorbance, Photoresist materials, Polymerization, Transparency, Glasses, Binary data, Photomasks, Dry etching

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Proceedings Article | 24 July 2002 Paper

High-performance 193-nm resist composition using hybrid copolymers of cycloolefin/maleic anhydride (COMA)/methacrylate

Dalil Rahman, Eric Alemy, Will Conley, Daniel Miller, Ralph Dammel, Woo-Kyu Kim, Takanori Kudo, Sang-Ho Lee, Seiya Masuda, Douglas McKenzie, Munirathna Padmanaban

Proceedings Volume 4690, (2002) https://doi.org/10.1117/12.474210

KEYWORDS: Polymers, Lithography, Line edge roughness, Photomasks, Semiconducting wafers, Lithographic illumination, Photoresist processing, Binary data, Fourier transforms, Etching

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Proceedings Article | 24 August 2001 Paper

Novel hybrid copolymers of cycloolefin/maleic anhydride (COMA)/methacrylate for 193-nm resist compositions

M. Rahman, Douglas McKenzie, Jun-Bom Bae, Takanori Kudo, Woo-Kyu Kim, Munirathna Padmanaban, Ralph Dammel

Proceedings Volume 4345, (2001) https://doi.org/10.1117/12.436845

KEYWORDS: Polymers, Lithography, Monochromatic aberrations, Absorption, Absorbance, Semiconducting wafers, Photomasks, Lithographic illumination, Carbon, Silicon

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Proceedings Article | 24 August 2001 Paper

Continuous metal removal technique for resist resins

Stan Wanat, Douglas McKenzie, M. Rahman

Proceedings Volume 4345, (2001) https://doi.org/10.1117/12.436877

KEYWORDS: Metals, Water, Solids, Ion exchange, Iron, Chromium, Raw materials, Photoresist materials, Electroluminescence, Sodium

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Proceedings Article | 24 August 2001 Paper

CD changes of 193-nm resists during SEM measurement

Takanori Kudo, Jun-Bom Bae, Ralph Dammel, Woo-Kyu Kim, Douglas McKenzie, M. Rahman, Munirathna Padmanaban, Waiman Ng

Proceedings Volume 4345, (2001) https://doi.org/10.1117/12.436847

KEYWORDS: Scanning electron microscopy, Polymers, Deep ultraviolet, Critical dimension metrology, Monochromatic aberrations, Photoresist processing, Lithography, Inspection, Thermal effects, Annealing

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Proceedings Article | 23 June 2000 Paper

Lithographic performance enhancement using top antireflective coating compositions made from water-soluble polymers

Sunit Dixit, M. Rahman

Proceedings Volume 3999, (2000) https://doi.org/10.1117/12.388257

KEYWORDS: Antireflective coatings, Coating, Lithography, Polymers, Reflectivity, Bottom antireflective coatings, Thin films, Scanning electron microscopy, Optical lithography, Thin film devices

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Proceedings Article | 23 June 2000 Paper

High-yield resin fractionation using a liquid/liquid centrifuge

Stan Wanat, M. Rahman, Balaji Narasimhan, Douglas McKenzie, Michelle Cook

Proceedings Volume 3999, (2000) https://doi.org/10.1117/12.388336

KEYWORDS: Solids, Picture Archiving and Communication System, Water, Lithography, Manufacturing, Liquids, Carbon, Photoresist materials, Raw materials, Electroluminescence

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Proceedings Article | 23 June 2000 Paper

Cycloolefin-maleic anhydride copolymers for 193-nm resist compositions

M. Rahman, Jun-Bom Bae, Michelle Cook, Dana Durham, Takanori Kudo, Woo-Kyu Kim, Munirathna Padmanaban, Ralph Dammel

Proceedings Volume 3999, (2000) https://doi.org/10.1117/12.388306

KEYWORDS: Polymers, Absorbance, Polymerization, Lithography, Polymer thin films, Semiconducting wafers, Carbon, Etching, Chemical analysis, Dry etching

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Proceedings Article | 23 June 2000 Paper

Application of photodecomposable base concept to 193-nm resists

Munirathna Padmanaban, Jun-Bom Bae, Michelle Cook, Woo-Kyu Kim, Axel Klauck-Jacobs, Takanori Kudo, M. Rahman, Ralph Dammel, Jeff Byers

Proceedings Volume 3999, (2000) https://doi.org/10.1117/12.388278

KEYWORDS: Polymers, Absorption, Semiconducting wafers, Photoresist materials, Diffusion, Absorbance, Chemically amplified resists, Molecules, Solids, Energy transfer

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