Mr. Sukwon Park Profile

Sukwon Park

at SK Hynix Inc

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 27 April 2023 Poster + Paper

Residuals reduction in imaging-based overlay using color per layer

Shlomit Katz, Suk Won Park, Joonsang You, Hyunjun Kim, Honggoo Lee, Jungchan Kim, Dongyoung Lee, Hongbok Yeon, Joonseuk Lee, Sang-Ho Lee, Jae Wook Seo, Dor Yehuda, Junho Kim, Hongcheon Yang, Dohwa Lee, Nanglyeom Oh, Dongsub Choi, Wayne Zhou, Hedvi Spielberg, Ohad Bachar

Proceedings Volume 12496, 1249626 (2023) https://doi.org/10.1117/12.2655681

KEYWORDS: Metrology, Overlay metrology, High volume manufacturing, Optical parametric oscillators, Optical gratings, Visualization

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Proceedings Article | 26 May 2022 Poster + Presentation + Paper

Advanced CD uniformity correction using radial basis function (RBF) models

Philip Groeger, Ulrich Denker, Robin Zech, Stefan Buhl, Matthias Ruhm, Mingyu Kim, Hongseok Jang, Chunsoo Kang, Dongyoung Lee, Hyunjun Kim, Sukwon Park, Bohye Kim, Honggoo Lee, Sangho Lee, Dongsub Choi, Jeonghoon Lee

Proceedings Volume 12053, 1205314 (2022) https://doi.org/10.1117/12.2607571

KEYWORDS: Semiconducting wafers, Data modeling, Scanners, Critical dimension metrology, Performance modeling, Mathematical modeling, Etching, Error analysis, Algorithm development, Zernike polynomials, Modeling, Modeling and simulation

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Proceedings Article | 26 May 2022 Presentation + Paper

Overlay stability control in IBO measurement using rAIM target

Nahee Park, Dohwa Lee, Liu Liu, Xuefei Zhou, Hongpeng Su, Dongsub Choi, Wayne Zhou, Hedvi Spielberg, Efi Megged, Chen Dror, Diana Shaphirov, Zephyr Liu, Mark Ghinovker, Dongyoung Lee, Hongbok Yeon, Hyunjun Kim, Sukwon Park, Bohye Kim, Honggoo Lee, Sangho Lee

Proceedings Volume 12053, 120530E (2022) https://doi.org/10.1117/12.2608053

KEYWORDS: Overlay metrology, Process control, Optical lithography, Metrology, Inspection, Semiconducting wafers, Data modeling, Wafer-level optics, Optical properties, Optical design

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Proceedings Article | 26 May 2022 Poster + Paper

Spectral analysis overlay measurement approach for improvement of overlay accuracy in advanced integrated circuits

Vladimir Levinski, Yuri Paskover, Sharon Aharon, Daria Negri, Nadav Gutman, K. Nireekshan Reddy, Jeongpyo Lee, Hedvi Spielberg, Dongyoung Lee, Hyunjun Kim, Sukwon Park, Bohye Kim, Hongseok Jang, Honggoo Lee, Sangho Lee

Proceedings Volume 12053, 120531Z (2022) https://doi.org/10.1117/12.2613981

KEYWORDS: Semiconducting wafers, Overlay metrology, Process control, Integrated circuits, Wafer-level optics, Scanners, Principal component analysis, Manufacturing, Inspection, Accuracy assessment

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