Massive overlay metrology solution by realizing imaging Mueller matrix spectroscopic ellipsometry

Jaehyeon Son; Juntaek Oh; Eunsoo Hwang; Jinwoo Ahn; Jaewon Lee; Byungkwan Oh; Donggun Lee; Seunga Lim; Kihun Kang; Sangil Im; Jibin Jeong; Taehyun Yun; Jinsoo Lee; Changhyeong Yoon; Hyukjoon Cho; Gangbu Kim; Byeongki Kang; Hankyoul Moon; Jong-hyun Hwang; Youngkyu Park; Taejoong Kim; Suyoung Lee; Yusin Yang; Myungjun Lee

doi:10.1117/12.2657414

27 April 2023 Massive overlay metrology solution by realizing imaging Mueller matrix spectroscopic ellipsometry

Jaehyeon Son, Juntaek Oh, Eunsoo Hwang, Jinwoo Ahn, Jaewon Lee, Byungkwan Oh, Donggun Lee, Seunga Lim, Kihun Kang, Sangil Im, Jibin Jeong, Taehyun Yun, Jinsoo Lee, Changhyeong Yoon, Hyukjoon Cho, Gangbu Kim, Byeongki Kang, Hankyoul Moon, Jong-hyun Hwang, Youngkyu Park, Taejoong Kim, Suyoung Lee, Yusin Yang, Myungjun Lee

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124960L (2023) https://doi.org/10.1117/12.2657414
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

In recent years, the overlay specifications of advanced semiconductor devices have become extremely stringent. This challenging situation becomes severe for every new generation of the device development. However, conventional overlay metrology systems have limited throughput due to their point-based nature. Here, we first demonstrate the novel imaging Mueller-matrix spectroscopic ellipsometry (MMSE) technique, which can measure the overlay error of all cell blocks on a device wafer with extremely high throughput, much faster than conventional point-based spectroscopic ellipsometry (SE) technologies. It provides the super large field of view (FOV) ~ 20 × 20 mm² together with high sensitivity based on Mueller information, which will be truly innovated solution not only for the overlay metrology, but also for critical dimension (CD) measurement, eventually maximizing process control and productivity of advanced node.

Conference Presentation

Citation Download Citation

Jaehyeon Son, Juntaek Oh, Eunsoo Hwang, Jinwoo Ahn, Jaewon Lee, Byungkwan Oh, Donggun Lee, Seunga Lim, Kihun Kang, Sangil Im, Jibin Jeong, Taehyun Yun, Jinsoo Lee, Changhyeong Yoon, Hyukjoon Cho, Gangbu Kim, Byeongki Kang, Hankyoul Moon, Jong-hyun Hwang, Youngkyu Park, Taejoong Kim, Suyoung Lee, Yusin Yang, and Myungjun Lee "Massive overlay metrology solution by realizing imaging Mueller matrix spectroscopic ellipsometry", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124960L (27 April 2023); https://doi.org/10.1117/12.2657414

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available