Dr. Jing Guo Profile

Dr. Jing Guo

Advisory Engineer/Scientist at IBM Thomas J. Watson Research Ctr

SPIE Involvement:

Author

Profile Summary

Advisory Engineer/Scientist at IBM Research in Albany, NY since 2016. Research focus: semiconductor material and process technology. Currently working on advanced patterning for N7 and B7 technology enablement and patterning fundamental study, including materials performance improvement and novel patterning processes. Ph.D. in Chemistry from UMASS Amherst.

Publications (16)

Proceedings Article | 24 February 2021 Presentation + Paper

Presentation + Paper

EUV single exposure via patterning at aggressive pitch

Jing Guo, Jennifer Church, Luciana Meli, Anuja de Silva, Martin Burkhardt, Karen Petrillo, Mary Breton, Cody Murray, Lijuan Zou, Allen Gabor, Nelson Felix

Proceedings Volume 11609, 116090U (2021) https://doi.org/10.1117/12.2582563

KEYWORDS: Optical lithography, Etching, Stochastic processes, Semiconducting wafers, Resolution enhancement technologies, Extreme ultraviolet lithography, Scanners, Inspection, Source mask optimization, Photoresist processing

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SPIE Journal Paper | 1 July 2020 Open Access

Open Access

Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch

Jennifer Church, Luciana Meli, Jing Guo, Martin Burkhardt, Chris Mack, Anuja De Silva, Karen Petrillo, Mary Breton, Ravi Bonam, Romain Lallement, Eric Miller, Brad Austin, Shravan Matham, Nelson Felix

JM3, Vol. 19, Issue 03, 034001, (July 2020) https://doi.org/10.1117/12.10.1117/1.JMM.19.3.034001

KEYWORDS: Stochastic processes, Fiber optic illuminators, Line edge roughness, Critical dimension metrology, Defect inspection, Extreme ultraviolet, Inspection, Optical lithography, Yield improvement

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Proceedings Article | 17 April 2020 Presentation + Paper

Presentation + Paper

Dual tone sub-resolution assist features to improve corner rounding

Cheng Chi, Hao Tang, Oseo Park, Jing Xue, Jing Guo, Geng Han, Charlie King, Jeff Shearer, Sean Burns

Proceedings Volume 11327, 113270E (2020) https://doi.org/10.1117/12.2550834

KEYWORDS: SRAF, Photomasks, Semiconducting wafers, Optical proximity correction, Data modeling, Yield improvement, Optics manufacturing, Optical lithography, Deep ultraviolet, Logic

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Proceedings Article | 23 March 2020 Presentation + Paper

Presentation + Paper

Fundamental characterization of stochastic variation for improved single-expose EUV patterning at aggressive pitch

Jennifer Church, Luciana Meli, Jing Guo, Martin Burkhardt, Chris Mack, Anuja DeSilva, Karen Petrillo, Mary Breton, Ravi Bonam, Romain Lallement, Eric Miller, Brad Austin, Shravan Matham, Nelson Felix

Proceedings Volume 11323, 113230O (2020) https://doi.org/10.1117/12.2551487

KEYWORDS: Stochastic processes, Line edge roughness, Inspection, Defect inspection, Critical dimension metrology, Extreme ultraviolet, Optical lithography, Etching, Bridges

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Proceedings Article | 26 March 2019 Presentation + Paper

Presentation + Paper

Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning

Chi-Chun Liu, Richard Farrell, Kafai Lai, Yann Mignot, Eric Liu, Jing Guo, Yasuyuki Ido, Makoto Muramatsu, Nelson Felix, David Hetzer, Akiteru Ko, John Arnold, Daniel Corliss

Proceedings Volume 10958, 109580L (2019) https://doi.org/10.1117/12.2515862

KEYWORDS: Metals, Critical dimension metrology, Etching, Directed self assembly, Optical lithography, Back end of line, Lithography, Overlay metrology

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Proceedings Article | 26 March 2019 Presentation + Paper

Presentation + Paper

LCDU improvement of EUV-patterned vias with DSA

Jing Guo, Dustin Janes, Yann Mignot, Richard Johnson, Cheng Chi, Chi-Chun Liu, Luciana Meli, Takuya Kuroda, Domenico DiPaola, Yuji Tanaka, Harumoto Masahiko, Nelson Felix, Daniel Corliss

Proceedings Volume 10958, 109580N (2019) https://doi.org/10.1117/12.2515153

KEYWORDS: Polymethylmethacrylate, Optical lithography, Extreme ultraviolet lithography, Critical dimension metrology, Etching, Chemistry, Ultraviolet radiation, Defect inspection, Extreme ultraviolet, Polymers

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Lithographic and pitch-multiplying spacer technologies are widely used to shrink interconnect periodicity within critical layers. This places significant burden on overlay and CD uniformity of the subsequently patterned vias to physically contact and electrically connect critical layers to the rest of the integrated circuit in a nearly defect-free and perfectly-consistent manner. We are evaluating the combination of EUV and DSA patterning technologies to meet this challenge and enable future technology nodes. The contact hole guide pattern is fabricated atop bilayer hardmask material by single-exposure EUV, surface-modified with telechelic polymer brush materials, and finally shrunk/rectified using self-assembled, lamella-forming polystyrene-block-polymethylmethacrylate (PS-b-PMMA). The nascent via pattern is then blanket exposed by DUV light and the photolyzed PMMA is selectively rinsed away. Here we study the process performance of DSA pattern wet etch chemistry and subsequent dry etch pattern transfer into bilayer hardmask material using both metrology and electrical yield measurements as evaluation criteria. In particular, the choice of wet etch solvation strength selective towards PMMA was varied from moderate (isopropanol, IPA) to good (acetic acid, AAc). Due to the ability of AAC to solubilize all covalently-untethered PMMA, regardless of molecular weight, the resulting average CD is wider and its local distribution is more uniform. In contrast, IPA is only capable of rinsing away the smallest PMMA fragments, resulting in relatively tighter bounds about the preferable blanket UV dose, and a smaller average CD and less-uniform local CD distribution. These morphological differences are confirmed by cross-sectional transmission electron micrographs. Brightfield inspection and inline electrical testing are used to compare relative defectivity and yield, respectively, to assess the potential impact on device performance for processes utilizing either solvent.

Proceedings Article | 3 October 2018 Presentation + Paper

Presentation + Paper

Study of resist hardmask interaction through surface activation layers

Anuja De Silva, Luciana Meli, Jing Guo, Jennifer Church, Nelson Felix, Dario Goldfarb, Bharat Kumar, Rudy Wojtecki, Magi Mettry, Alexander Hess

Proceedings Volume 10809, 1080916 (2018) https://doi.org/10.1117/12.2501824

KEYWORDS: Polymers, Semiconductors, Interfaces, Silicon, Head-mounted displays, Etching, Electron beam lithography, Optical lithography, Semiconductor materials, Oxides

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Proceedings Article | 6 September 2018 Paper

Paper

Computational enablement for designs with sub-20nm metal tip to tip using cut shapes from grapho-epitaxy directed self-assembly

Balint Meliorisz, Kafai Lai, Ulrich Welling, Hans-Jürgen Stock, Sajan Marokkey, Thomas Muelders, Jing Sha, Chi-chun Liu, Cheng Chi, Jing Guo, Clifford Osborn, Jaime Morillo, Wolfgang Demmerle, Derren Dunn

Proceedings Volume 10586, 105860R (2018) https://doi.org/10.1117/12.2297344

KEYWORDS: Metals, Directed self assembly, Critical dimension metrology, Calibration, Error analysis, Etching, Computer simulations, Process modeling, Optical lithography, Extreme ultraviolet lithography

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SPIE Journal Paper | 31 July 2018

Inorganic hardmask development for extreme ultraviolet patterning

Anuja De Silva, Ashim Dutta, Luciana Meli, Yiping Yao, Yann Mignot, Jing Guo, Nelson Felix

JM3, Vol. 18, Issue 01, 011004, (July 2018) https://doi.org/10.1117/12.10.1117/1.JMM.18.1.011004

KEYWORDS: Etching, Optical lithography, Extreme ultraviolet, Head-mounted displays, Silicon, Chemistry, Amorphous silicon, Argon, Polymers, Interfaces

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Proceedings Article | 9 April 2018 Presentation + Paper

Presentation + Paper

Polymer brush as adhesion promoter for EUV patterning

Jing Guo, Anuja De Silva, Yann Mignot, Yongan Xu, Abraham Arceo de la Pena, Luciana Meli, Indira Seshadri, Dominik Metzler, Lovejeet Singh, Tsuyoshi Furukawa, Ramakrishnan Ayothi, Nelson Felix, Dan Corliss

Proceedings Volume 10586, 105860I (2018) https://doi.org/10.1117/12.2297113

KEYWORDS: Chemistry, Polymers, Printing, Etching, Optical lithography, Extreme ultraviolet, Photomasks, Extreme ultraviolet lithography, Dielectrics, Semiconducting wafers

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Proceedings Article | 28 March 2018 Paper

Paper

The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD

Chi-Chun Liu, Yann Mignot, Cheng Chi, Richard Farrell, Kafai Lai, Jing Guo, Jing Sha, Martin Glodde, Makoto Muramatsu, Yasuyuki Ido, Nelson Felix, David Hetzer, Andrew Metz, Daniel Corliss

Proceedings Volume 10584, 105840L (2018) https://doi.org/10.1117/12.2297365

KEYWORDS: Etching, Critical dimension metrology, Metals, Directed self assembly, Oxides, Back end of line, Dielectrics, Scanning electron microscopy, Tin, Lithography

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Proceedings Article | 19 March 2018 Presentation + Paper

Presentation + Paper

Inorganic hardmask development for EUV patterning

Anuja De Silva, Ashim Dutta, Luciana Meli, Yiping Yao, Yann Mignot, Jing Guo, Nelson Felix

Proceedings Volume 10583, 105830V (2018) https://doi.org/10.1117/12.2296751

KEYWORDS: Etching, Optical lithography, Chemistry, Head-mounted displays, Silicon, Argon, Amorphous silicon, Polymers, Extreme ultraviolet, Interfaces

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SPIE Journal Paper | 28 August 2017

Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer

Indira Seshadri, Anuja De Silva, Luciana Meli, Chi-Chun Charlie Liu, Cheng Chi, Jing Guo, Hoa Truong, Kristin Schmidt, John Arnold, Nelson Felix, Lovejeet Singh, Tsuyoshi Furukawa, Ramakrishnan Ayothi, Angelique Raley, Richard Farrell

JM3, Vol. 16, Issue 03, 033506, (August 2017) https://doi.org/10.1117/12.10.1117/1.JMM.16.3.033506

KEYWORDS: Oxides, Polymers, Extreme ultraviolet, Optical lithography, Head-mounted displays, Etching, Atomic layer deposition, Chemistry, Plasma enhanced chemical vapor deposition, Printing

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Proceedings Article | 27 April 2017 Presentation + Paper

Presentation + Paper

Advanced fast 3D DSA model development and calibration for design technology co-optimization

Kafai Lai, Balint Meliorisz, Thomas Muelders, Ulrich Welling, Hans-Jürgen Stock, Sajan Marokkey, Wolfgang Demmerle, Chi-Chun Liu, Cheng Chi, Jing Guo

Proceedings Volume 10144, 101440H (2017) https://doi.org/10.1117/12.2260379

KEYWORDS: 3D modeling, Calibration, Data modeling, Optical lithography, Nanotechnology, Very large scale integration, System on a chip, Logic, Research facilities

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Proceedings Article | 13 April 2017 Presentation + Paper

Presentation + Paper

Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle

Cheng Chi, Chi-Chun Liu, Luciana Meli, Jing Guo, Doni Parnell, Yann Mignot, Kristin Schmidt, Martha Sanchez, Richard Farrell, Lovejeet Singh, Tsuyoshi Furukawa, Kafai Lai, Yongan Xu, Daniel Sanders, David Hetzer, Andrew Metz, Sean Burns, Nelson Felix, John Arnold, Daniel Corliss

Proceedings Volume 10146, 101460Q (2017) https://doi.org/10.1117/12.2260454

KEYWORDS: Etching, Directed self assembly, Polymethylmethacrylate, Critical dimension metrology, Picosecond phenomena, Oxides, Scanning electron microscopy, Optical lithography, Extreme ultraviolet, Metals

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Proceedings Article | 24 March 2017 Presentation + Paper

Presentation + Paper

Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer

Indira Seshadri, Anuja De Silva, Luciana Meli, Charlie Liu, Cheng Chi, Jing Guo, Kristin Schmidt, Hoa Truang, John Arnold, Nelson Felix, Lovejeet Singh, Tsuyoshi Furukawa, Ramakrishnan Ayothi, Angelique Raley, Richard Farrell

Proceedings Volume 10143, 101431D (2017) https://doi.org/10.1117/12.2258565

KEYWORDS: Extreme ultraviolet, Optical lithography, Polymers, Etching, Extreme ultraviolet lithography, Photoresist materials, Lithography, Photoresist processing, Back end of line, Oxides, Head-mounted displays, Atomic layer deposition, Chemistry

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Showing 5 of 16 publications

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