Executive with profound background in technology and digital. Strong interpersonal and networking skills, inspirational leadership, strategic thinking, and execution skills. Experienced with all stages of the development cycle of innovative startups, scaleups and tech companies.
General Management, Technology Management, Research & Development, Strategic Planning, Business Development, Project Management, Relationship Development, Intellectual Property, Quality Assurance, Problem Resolution, Communications, Technical Publications, Technical Presentations and Finance.
Expert Innosuisse - Suisse Innovation Agency
SPIE Fellow, OSA Senior Member, Member of EOS, DGAO, SSOM, Swissmem, Swissphotonics and Sand Hill Angels.
Technical: Photonics, Nanotechnology, Engineering, Micro-Optical Elements, Microlens Arrays, Optical Design, Optical Interconnections, Fiber Optics, Telecom, Datacom, Silicon Photonics, Optical Bio-Chips, Chemical Micro-Chips, Optical Sensors, Metrology, MEMS, MOEMS, Bio-MEMS, Microfluidic, Laser, Med-Tech, Data Sciences, Big Data, Miniaturized Cameras, Ultra-Flat Cameras, Wafer-Level Cameras, Wafer-Level Packaging, Wafer-Based Micro-Fabrication.
General Management, Technology Management, Research & Development, Strategic Planning, Business Development, Project Management, Relationship Development, Intellectual Property, Quality Assurance, Problem Resolution, Communications, Technical Publications, Technical Presentations and Finance.
Expert Innosuisse - Suisse Innovation Agency
SPIE Fellow, OSA Senior Member, Member of EOS, DGAO, SSOM, Swissmem, Swissphotonics and Sand Hill Angels.
Technical: Photonics, Nanotechnology, Engineering, Micro-Optical Elements, Microlens Arrays, Optical Design, Optical Interconnections, Fiber Optics, Telecom, Datacom, Silicon Photonics, Optical Bio-Chips, Chemical Micro-Chips, Optical Sensors, Metrology, MEMS, MOEMS, Bio-MEMS, Microfluidic, Laser, Med-Tech, Data Sciences, Big Data, Miniaturized Cameras, Ultra-Flat Cameras, Wafer-Level Cameras, Wafer-Level Packaging, Wafer-Based Micro-Fabrication.
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Correction of surface error occurring in microlenses characterization performed by optical profilers
Holographic optical coupling and beamsplitting elements for optoelectronic interconnects and sensors
This will count as one of your downloads.
You will have access to both the presentation and article (if available).
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